Title:
HEAT DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/191650
Kind Code:
A1
Abstract:
A heat dissipating assembly (200) and an electronic device. The heat dissipating assembly (200) comprises a printed circuit board (240), a heat dissipating device (220), and a chip (230) provided on the surface of the printed circuit board (240); a through hole (241) penetrating through the printed circuit board (240) is provided in an area of the surface covered by the chip (230); the through hole (241) extends from the surface to another surface of the printed circuit board (240) opposite to the surface; the heat dissipating device (220) performs heat dissipation on the chip (230) by means of the through hole (241). In the technical solution, the printed circuit board (240) is provided with the through hole (241) at a positon provided with the chip (230) so that the lower surface of the chip (230) can be exposed. Therefore, the chip (230) may be subjected to heat dissipation under the chip (230) by the heat dissipating device (220) without the need for disposing a heat dissipating material on or above the upper surface of the chip (230).
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Inventors:
HUANG LUNXUE (CN)
GUO PENG (CN)
GUO PENG (CN)
Application Number:
PCT/CN2019/079843
Publication Date:
October 01, 2020
Filing Date:
March 27, 2019
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/36; H01L23/40
Foreign References:
| CN101601131A | 2009-12-09 | |||
| CN205900524U | 2017-01-18 | |||
| CN106129024A | 2016-11-16 | |||
| CN2494524Y | 2002-06-05 | |||
| US6816375B2 | 2004-11-09 | |||
| CN201273486Y | 2009-07-15 |
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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