Title:
HEAT DISSIPATING CHASSIS AND HEAT DISSIPATING CASE
Document Type and Number:
WIPO Patent Application WO/2008/015775
Kind Code:
A1
Abstract:
Disclosed are a heat dissipating chassis and a heat dissipating case which are excellent in moldability, thermal conductivity, heat dissipating property and electromagnetic shielding property. The heat dissipating chassis and the heat dissipating case respectively have a thermal conductivity and a heat dissipation rate generally intermediate between those of a metal and those of a general purpose resin. Specifically disclosed is a heat dissipating chassis used for dissipating heat from a heating body or a heat dissipating case used for housing a heating body, which is composed of a heat conductive resin composition containing a thermoplastic resin [A] and a specific heat conductive filler [B]. The blend amount of the heat conductive filler [B] per 100 parts by mass of the thermoplastic resin [A] is 10-1,000 parts by mass.
Inventors:
FUJIOKA SHINSUKE (JP)
KITADA FUSAMICHI (JP)
KITADA FUSAMICHI (JP)
Application Number:
PCT/JP2007/000761
Publication Date:
February 07, 2008
Filing Date:
July 12, 2007
Export Citation:
Assignee:
TECHNO POLYMER CO LTD (JP)
FUJIOKA SHINSUKE (JP)
KITADA FUSAMICHI (JP)
FUJIOKA SHINSUKE (JP)
KITADA FUSAMICHI (JP)
International Classes:
C08L101/00; C08K3/04; C08K3/22; C08K3/38
Domestic Patent References:
| WO2006126606A1 | 2006-11-30 | |||
| WO2005111146A1 | 2005-11-24 |
Foreign References:
| JP2007224265A | 2007-09-06 | |||
| JP2007099820A | 2007-04-19 | |||
| JP2007070608A | 2007-03-22 | |||
| JP2005146124A | 2005-06-09 | |||
| JP2005272814A | 2005-10-06 | |||
| JP2001214065A | 2001-08-07 |
Attorney, Agent or Firm:
OKADA, Kazuhiko (6F Kudan Kangyo Bldg.,10-1, Kudan-kita 1-chom, Chiyoda-ku Tokyo 73, JP)
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