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Patent Searching and Data


Title:
HEAT DISSIPATING DIE BONDING FILM, AND DICING/DIE BONDING FILM
Document Type and Number:
WIPO Patent Application WO/2019/017303
Kind Code:
A1
Abstract:
The present invention pertains to a heat dissipating die bonding film having a thermal conductivity of 2W/(m·K) or more, wherein the heat dissipating die bonding film contains two or more types of thermally conductive fillers having different Moh's hardnesses, and has an abrasion amount of a blade in a dicing process being 50 µm/m or less, or the heat dissipating die bonding film contains two or more types of thermally conductive fillers having different Moh's hardnesses and a content of 20-85 mass%.

Inventors:
UENO KEIKO (JP)
MASUKO TAKASHI (JP)
SUGAI SHOUTA (JP)
Application Number:
JP2018/026571
Publication Date:
January 24, 2019
Filing Date:
July 13, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/52; C09J7/00; C09J11/04; C09J11/06; C09J133/00; C09J163/00; C09J201/00; H01L21/301; H01L23/36
Domestic Patent References:
WO2013145961A12013-10-03
Foreign References:
JP2012207222A2012-10-25
JP2011070930A2011-04-07
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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