TECHNICAL FIELD

The present disclosure relates generally to the field of cooling systems; and more specifically to a heat dissipating element for a notebook computer cooling system, a cooling system for a notebook computer, and a method of manufacturing the heat dissipating element for the notebook computer cooling system.

BACKGROUND

With advancements in technology, computing devices, for example, laptops, have become more technically advanced in terms of functionality and output generation. The present laptops have improved power and thus consequently there is increased heat generation of CPU (Central Processing Unit) and/or GPU (Graphics Processing Unit) in the laptops (specifically, in gaming laptops). However, there is limitation associated with a space of the laptop or tablet computing devices, due to which it becomes a challenging task to produce an efficient and user-friendly (i.e., low noise, low weight, no active maintenance) cooling system for the laptops (or other portable small sized computing devices, like tablet computing devices).

Conventionally, in laptop liquid cooling systems the generated heat (from CPU and/or GPU) is dissipated from a desktop back cover surface of the laptop. Further, there is a closed loop charged with a liquid that operates as a carrier. The loop consists of a cold plate located in a keyboard section of the laptop. The cold plate is attached to a heat generating unit (the CPU and/or the GPU) and absorbs the heat with the help of a cooling liquid inside the cold pate. The heated liquid is pumped using a micro-pump to other (i.e., second) cold plate which is located in a desktop section of the laptop. The second cold plate is attached to a metallic back cover of the laptop. Thus, the second cold plate dissipates the heat out to the ambient and thereby cooling down the liquid passing through the dissipating cold plate in the desktop section. Thus, the liquid returns to the keyboard section cooled down and is ready to absorb the heat from the heat source again, thereby closing the loop of the cooling system. However, there are problems associated with the aforesaid known liquid cooling solution due to limited space (such as a gap of just hundred micrometers) which is available for heat dissipating cold plate in the desktop section. In the given restricted boundaries, there is a trade-off between pressure losses and thermal efficiency of the dissipating cold plate. The thermal efficiency refers to a temperature distribution along the desktop back cover which is to be as even as possible in the given boundaries. In other words, the hot liquid that enters the heat dissipating cold plate must be able to cool down to the lowest possible temperature, i.e. a temperature of ambient air, and after that move back to the cold plate inside the keyboard section of the laptop. Otherwise, the cooling liquid with relatively high temperature (i.e., above ambient temperature level) when returns to the heat absorbing cold plate, is heated up while receiving the excessive heat from the CPU and/or the GPU and enters the heat dissipating cold plate in the desktop section with increased temperature, compared to a previous circulation cycle. Therefore, a steady state temperature of such cooling system is set at a higher level gradually, than it might have been set in case of thermally efficient design.

Further, in some systems the desktop back cover may be made of Aluminium, which can have thermal conductivity level of, e.g., 200W/mK. In such systems, the desktop back cover may be effectively part of the liquid cooling system. However, to reduce a weight of the laptop, a weight of the cooling system may be reduced. Thus, a material with lower density is used, such as Al-Mg alloy. However, for the alloys the thermal conductivity drops below lOOW/mK. Further, plates of this Al-Mg alloy are thin (i.e., less than 1mm thickness) and thus heat spreading abilities deteriorates compared to the case with the back cover made of Aluminium.

Some conventional techniques use U-shaped heat dissipater or Snake-type heat dissipater. The U-shape or the Snake-type designs lead to increased pressure losses in case of narrow channels and multiple turns of flow. In some conventional techniques, the dissipating cold plate is designed by enlarging the contact area between the liquid (cold plate wall) and the metal back cover of the desktop. However, in some cases, there may be regions with low (or even close to zero) velocity of liquid result into limited heat transfer in the pointed regions.

Further, in some cases, a heat dissipater with improper mechanical design may lack the mechanical strength to resist inner pressure changes and may expand or shrink depending on the inner pressure of the loop with respect to ambient pressure level. This further leads to loss of thermal contact between the cold plate and the metal back cover of the desktop and reduces the overall thermal efficiency of the whole cooling loop. Thus, there is technical problem of reduced thermal efficiency and increased losses in the conventional liquid cooling systems.

Therefore, in light of the foregoing discussion, there exists a need to overcome the afore mentioned drawbacks associated with conventional cooling of the laptops.

SUMMARY

The present disclosure seeks to provide a heat dissipating element for a notebook computer cooling system, a cooling system for a notebook computer and a method of manufacturing the heat dissipating element for the notebook computer cooling system. The present disclosure seeks to provide a solution to the existing problem of reduced thermal efficiency and increased pressure losses in conventional cooling systems. An aim of the present disclosure is to provide a solution that overcomes at least partially the problems encountered in prior art and provides and improved cooling system which provides increased thermal efficiency, increased mechanical strength with controlled pressure losses in comparison to conventional cooling systems.

The object of the present disclosure is achieved by the solutions provided in the enclosed independent claims. Advantageous implementations of the present disclosure are further defined in the dependent claims.

In one aspect, the present disclosure provides a heat dissipating element for a notebook computer cooling system, comprising: an inlet arranged in a lower comer of a screen section of the notebook computer and configured to receive heated fluid; an outlet arranged in an opposite lower comer of the screen section to return cooled fluid; a rising section arranged to carry the fluid from the inlet to a top comer of the screen section; and a falling section arranged to cany the fluid from the rising section to the outlet.

The heat dissipating element of the present disclosure provides an improved thermal performance i.e., the fluid used for absorbing heat of the notebook computer is cooled to an ambient temperature level. Thus, in comparison to conventional heat dissipating element no fluid with relatively high temperature (i.e., above ambient temperature level) returns for heat absorption. As a result, the heat dissipating element provides improved cooling performance and/or improved cooling efficiency. Beneficially, the heat dissipating element of the present disclosure provide even heat distribution i.e., spreading of heat from fluid is even throughout the screen section.

In an implementation form, the rising section is arranged to follow a substantially diagonal path from the inlet to an opposite top comer of the screen section.

By virtue of the substantially diagonal path, heat of the fluid is dissipated by the screen section. The screen section is heated evenly along the substantially diagonal path, i.e. evenly spreading of the heat from heated fluid.

In a further implementation form, the falling section is arranged to follow a substantially vertical path from the rising section to the outlet.

Thus, before the fluid goes out for heat absorption, the fluid flowing in the substantially vertical path is cooled down to the ambient temperature level. Thus, there is improved thermal performance.

In a further implementation form, the heat dissipating element is formed to cover less than 50% of the total area of the screen section of the notebook computer.

Thus, the heat dissipating element has reduced weight and cost in comparison to conven tional heat dissipating elements. Further, the cover of less than 50% of the total area by the heat dissipating element enables suitable, i.e. thermally efficient heat dissipation by the screen section.

In a further implementation form, an area ratio between the area covered by the heat dissipating element and the total area of the screen section is 1 :4 or greater.

As a result, there is reduced weight and cost in comparison to conventional heat dissipating elements. Further, the 1:4 ratio enables improved accommodation of the heat dissipating element in the screen section.

In a further implementation form, the area covered by the rising section and the area covered by the falling section is substantially 1:1. The ratio of 1 : 1 for the rising section and the falling section ensures a non-constant volumetric flow of the fluid to and from the keyboard section to the screen section. The ratio ensures the volume flow rate in the rising section and in the falling section are different, reaching the thermal performances benefits by different velocity of fluid in rising and falling sections.

In a further implementation form, the heat dissipating element is formed such that the screen section comprises an upper free triangle which is not covered by the heat dissipating element, arranged in a top corner of the screen section above the inlet.

By virtue of the upper free triangle, a weight of the heat dissipating element and a weight of the fluid is reduced.

In a further implementation form, the heat dissipating element is formed such that a lower free triangle of the screen section is not covered by the heat dissipating element, arranged on a lower edge of the screen section between the inlet and the outlet.

Beneficially, the two triangle sections are free for dissipating heat into the environment. Thus, a total weight of the heat dissipating element is reduced compared to the traditionally designed heat dissipating units.

In a further implementation form, the heat dissipating element comprises a flat sheet and a shaped sheet forming a channel for the rising section and the falling section.

Thus, heat in the fluid flowing through the channel is dissipated via the screen section in the rising section. Further, the fluid flowing through the channel is further cooled in the falling section.

In a further implementation form, one of the flat sheet and the shaped sheet is formed integrally with a cover of the screen section.

Thus, one wall of the heat dissipating element is replaced with the cover so that the desktop cover inner surface acts as the wall of the heat dissipating element and provides mechanical structure support to the heat dissipating element. Further, there is an overall saving on weight of the cooling system.

In a further implementation form, the shaped sheet comprises a plurality of pillars formed within the channel and configured to contact the flat sheet and support the channel. The plurality of pillars provides mechanical strength to the channel. Beneficially, the mechanical strength ensures stable thermal contact with screen back cover within a whole operation of heat dissipation.

In a further implementation form, the shaped sheet is formed by an etching process or a stamping process.

The shaped sheet formed by the etching process have improved thermal efficiency with respect to their better ability to transfer heat via its pillar’s solid bodies. The etching process is replaced with the stamping process to enable reduction in weight of the heat dissipating element.

In a further implementation form, the high conductivity plate is arranged to cover the lower comer of the screen section where the inlet is located.

Beneficially, the high conductivity plate enables in spreading heat along the area of liquid entrance (where the fluid has highest temperature).

In another aspect, the present disclosure provides a cooling system for a notebook computer, comprising: a heat collecting element arranged in a keyboard section of the notebook computer; the heat dissipating element of any preceding claim, arranged in a screen section of the notebook computer; and a micropump configured to move fluid in a closed loop from the heat collecting element though the heat dissipating element and back to the heat collecting element.

The cooling system of the present disclosure provides an improved thermal performance i.e., the fluid used for absorbing heat of the notebook computer is cooled to an ambient temperature. Thus, in comparison to conventional liquid cooling system no fluid with relatively high temperature (i.e., above ambient temperature level) returns for heat absorption. As a result, the cooling system provides an improved cooling. Beneficially, the heat dissipating element of the present disclosure provides even heat distribution i.e., spreading of heat from fluid is even throughout the screen section. Further, there is reduced total weight of the heat dissipating element of the present disclosure in comparison to conventional heat dissipating element of liquid cooling systems. Further, there are controlled pressure losses with increased mechanical strength. In another aspect, the present disclosure provides a notebook computer comprising the cooling system.

The notebook computer achieves all the advantages and effects of the cooling system of the present disclosure.

In another aspect, the present disclosure provides a method of manufacturing a heat dissipating element for a notebook computer cooling system, comprising: forming a rising section to carry fluid from an inlet arranged in a lower comer of a screen section of the notebook computer to an opposite top comer of the screen section; and forming a falling section arranged to carry the fluid from the rising section to an outlet arranged in an opposite lower comer of the screen section.

The method achieves all the advantages and effects of the heat dissipating element of the present disclosure.

It is to be appreciated that all the aforementioned implementation forms can be combined. All steps which are performed by the various entities described in the present application as well as the functionalities described to be performed by the various entities are intended to mean that the respective entity is adapted to or configured to perform the respective steps and functionalities. Even if, in the following description of specific embodiments, a specific functionality or step to be performed by external entities is not reflected in the description of a specific detailed element of that entity which performs that specific step or functionality, it should be clear for a skilled person that these methods and functionalities can be implemented in respective software or hardware elements, or any kind of combination thereof. It will be appreciated that features of the present disclosure are susceptible to being combined in various combinations without departing from the scope of the present disclosure as defined by the appended claims.

Additional aspects, advantages, features and objects of the present disclosure would be made apparent from the drawings and the detailed description of the illustrative implementations construed in conjunction with the appended claims that follow. BRIEF DESCRIPTION OF THE DRAWINGS

The summary above, as well as the following detailed description of illustrative embodiments, is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the present disclosure, exemplary constructions of the disclosure are shown in the drawings. However, the present disclosure is not limited to specific methods and instrumentalities disclosed herein. Moreover, those in the art will understand that the drawings are not to scale. Wherever possible, like elements have been indicated by identical numbers.

Embodiments of the present disclosure will now be described, by way of example only, with reference to the following diagrams wherein:

FIG. 1 A is an illustration of a heat dissipating element for a notebook computer liquid cooling system, in accordance with an embodiment of the present disclosure;

FIG. IB is a side view of a heat dissipating element for a notebook computer liquid cooling system, in accordance with an embodiment of the present disclosure;

FIG. 1C is a block diagram of a liquid cooling system for a notebook computer, in accordance with an embodiment of the present disclosure;

FIG. 2 is an illustration of a screen section with a heat dissipating element for a notebook computer, in accordance with an embodiment of the present disclosure;

FIG. 3A is an illustration of a heat dissipating element, in accordance with an embodiment of the present disclosure;

FIG. 3B is an illustration of a side view of a heat dissipating element in a screen section of a notebook computer, in accordance with an embodiment of the present disclosure; FIG. 3C is a cross-sectional view of a heat dissipating element, in accordance with an embodiment of the present disclosure;

FIG. 4A is an illustration of a shape of plurality of pillars of a shaped sheet of a heat dissipating element, in accordance with an embodiment of the present disclosure;

FIG. 4B is an illustration of a three-dimensional view of a shaped sheet comprising pillars having capsule shape, in accordance with an embodiment of the present disclosure; FIG. 4C is an illustration of a three-dimensional view of a shaped sheet comprising pillars having elongated wall shape, in accordance with an embodiment of the present disclosure; FIG. 5A is an illustration of a shaped sheet formed by etching process, in accordance with an embodiment of the present disclosure;

FIG. 5B is an illustration of a shaped sheet formed by stamping process, in accordance with an embodiment of the present disclosure;

FIG. 6 is an illustration of a heat dissipating element having high conductivity plate, in accordance with an embodiment of the present disclosure; and FIG. 7 is a flowchart of a method of manufacturing a heat dissipating element for a notebook computer liquid cooling system, in accordance with an embodiment of the present disclosure.

In the accompanying drawings, an underlined number is employed to represent an item over which the underlined number is positioned or an item to which the underlined number is adjacent. A non-underlined number relates to an item identified by a line linking the non- underlined number to the item. When a number is non-underlined and accompanied by an associated arrow, the non-underlined number is used to identify a general item at which the arrow is pointing.

DETAILED DESCRIPTION OF EMBODIMENTS

The following detailed description illustrates embodiments of the present disclosure and ways in which they can be implemented. Although some modes of carrying out the present disclosure have been disclosed, those skilled in the art would recognize that other embodiments for carrying out or practicing the present disclosure are also possible.

FIG. 1 A is an illustration of a heat dissipating element for a notebook computer liquid cooling system, in accordance with an embodiment of the present disclosure. With reference to FIG. 1A, there is shown an illustration 100A of a heat dissipating element 102. There is shown an inlet 104, a lower comer 106, a screen section 108 of the notebook computer, fluid 110, an outlet 112, an opposite lower comer 114, a rising section 116, a top comer 118 and a falling section 120.

In one aspect, the present disclosure provides a heat dissipating element 102 for a notebook computer liquid cooling system, comprising: an inlet 104 arranged in a lower corner 106 of a screen section 108 of the notebook computer and configured to receive heated fluid 110; an outlet 112 arranged in an opposite lower comer 114 of the screen section 108 to return cooled fluid 110; a rising section 116 arranged to carry the fluid 110 from the inlet 104 to a top comer 118 of the screen section 108; and a falling section 120 arranged to carry the fluid 110 from the rising section 116 to the outlet 112.

The heat dissipating element 102 is configured for the notebook computer liquid cooling system. In other words, the heat dissipating element 102 may be located on an inner side of a desktop back cover of the notebook computer. The heat dissipating element 102 may also be referred to as a cold plate. The heat dissipating element 102 has a gap for liquid movement. The liquid (i.e., a fluid) circulates in a loop to transfer heat from a Central Processing Unit (CPU) to the desktop back cover where the heat is dissipated into the ambient. The notebook computer herein refers to any computing device having a screen and other components such as keyboard section, CPU and/or GPU that may be generating heat. Examples of notebook computer may include but are not limited to laptop computers, personal computers and the like.

The heat dissipating element 102 comprises the inlet 104 arranged in a lower comer 106 of a screen section 108 of the notebook computer and configured to receive heated fluid 110. In other words, a hot liquid, i.e., heated fluid 110, is pumped to the opposite (furthest) region of the desktop surface. The inlet 104 is configured to receive the heated fluid 110 from a keyboard section of the notebook computer where the heat that is generated is absorbed by the fluid 110. The heated fluid 110 is provided at the inlet 104 to enable dissipation of heat in the fluid 110 by the screen section 108.

The heat dissipating element 102 further comprises the outlet 112 arranged in an opposite lower comer 114 of the screen section 108 to return cooled fluid 110. In other words, the heated fluid 110 flows down under gravity force and the heated fluid 110 is cooled down to the ambient temperature level. Thus, the heat dissipating element 102 ensures full use of the back cover heat dissipation ability. Further, there is no overheating of an outlet liquid line that reflows the fluid 110 to the heated area. The outlet 112 is configured to provide the cooled fluid 110 to the keyboard section of the notebook computer to enable further absorbing of heat by the fluid 110.

The heat dissipating element 102 further comprises the rising section 116 arranged to carry the fluid 110 from the inlet 104 to a top comer 118 of the screen section 108. The rising section 116 is arranged to carry the fluid 110 to enable dissipation of heat in the fluid 110 by the screen section 108, i.e., back cover, of the notebook computer. Further, more the surface of the back cover is heated up, more efficiently heat dissipation is executed. Due to the thermal conductivity of a metal back cover, the back cover is heated evenly along the inlet 104, i.e. spreading the heat that heated fluid 110 carries. The heated back cover further dissipates the heat into environment.

The heat dissipating element 102 further comprises the falling section 120 arranged to carry the fluid 110 from the rising section 116 to the outlet 112. Before the fluid 110 goes out to the keyboard section, the fluid 110 is cooled down to the ambient temperature level to avoid the case where heated fluid 110 returns to the keyboard section. Thus, the present disclosure provides a design of the outlet 112 as an extended downward region i.e., falling section 120. Beneficially, this falling section 120 allows fluid 100 to flow down with big contact area with the back cover to enable the fluid 100 to be cooled down to room temperature level.

According to an embodiment, the heat dissipating element 102 is formed to cover less than 50% of the total area of the screen section 108 of the notebook computer. Thus, the heat dissipating element 102 has reduced weight and cost in comparison to conventional heat dissipating elements of liquid cooling systems. Further, the cover of less than 50% of the total area by the heat dissipating element 102 enables suitable heat dissipation by the screen section 108.

According to an embodiment, an area ratio between the area covered by the heat dissipating element 102 and the total area of the screen section 108 is 1 :4 or greater. The notebook computer has limited space for accommodating the heat dissipating element 102, thus the area covered by the heat dissipating element 102 and the total area of the screen section 108 is in ratio of 1:4 or greater. Further, this leads to reduced weight and cost in comparison to conventional heat dissipating elements of liquid cooling systems. According to an embodiment, an inlet/outlet ratio between the area covered by the rising section 116 and the area covered by the falling section 120 is substantially 1:1. The ratio of 1:1 for the rising section 116 and the falling section 120 ensures a non-constant volumetric flow of the fluid 110 to and from the keyboard section to the screen section 108. The ratio ensures the volume flow rate in the rising section and in the falling section are different, reaching the thermal performances benefits by different velocity of fluid in rising and falling sections.

According to an embodiment, the heat dissipating element 102 is formed to have a thickness of less than 400 microns. A total thickness of the heat dissipating element 102 does not exceeds hundreds of microns such as less than 400 microns. This results in thin walls that may be fabricated from metal sheets.

The heat dissipating element 102 of the present disclosure provides an improved thermal performance i.e., the fluid 110 used for absorbing heat of the notebook computer is cooled to an ambient temperature level. Thus, in comparison to a conventional heat dissipating element of a liquid cooling system no fluid 110 with relatively high temperature (i.e. above ambient temperature level) returns for heat absorption. As a result, the heat dissipating element 102 provides an improved cooling efficiency. Beneficially, the heat dissipating element 102 of the present disclosure provides even heat distribution, i.e. spreading of heat from fluid 110, is even throughout the screen section 108.

FIG. IB is a side view of a heat dissipating element for a notebook computer cooling system, in accordance with an embodiment of the present disclosure. FIG. IB is described in conjunction with elements from FIG. 1 A. With reference to FIG. IB, there is shown an illustra tion 100B of the heat dissipating element 102 and the screen section 108 of the notebook computer. As shown, the heat dissipating element 102 has a small thickness compared to the screen section 108. The heat dissipating element 102 has a uniform thickness. In an example, the thickness of the heat dissipating element 102 may be in the range of 0.20 millimetres to 0.99 millimetres.

FIG. 1 C is a block diagram of a cooling system for a notebook computer, in accordance with an embodiment of the present disclosure. FIG. 1C is described in conjunction with elements from FIG. 1A and IB. With reference to FIG. 1C, there is shown a block diagram lOOC that includes a liquid cooling system 122, a notebook computer 124, a heat collecting element 126, a keyboard section 128, a micropump 130, the heat dissipating element 102 and the screen section 108.

In another aspect, the present disclosure provides a cooling system 122 for a notebook computer 124, comprising: a heat collecting element 126 arranged in a keyboard section 128 of the notebook computer 124; the heat dissipating element 102 of any preceding claim, arranged in a screen section 108 of the notebook computer 124; and a micropump 130 configured to move fluid 110 in a closed loop from the heat collecting element 126 though the heat dissipating element 102 and back to the heat collecting element 126.

In another aspect, the present disclosure provides a notebook computer 124 comprising the liquid cooling system 122.

The liquid cooling system 122 for the notebook computer 124 is configured to collect heat from the keyboard section 128 in a fluid such as the fluid 110, absorb and dissipate heat from the fluid 110 which is heated in the keyboard section 128 and cool the fluid 110 for moving the fluid 110 back to the keyboard section 128. The notebook computer 124 herein refers to any computing device having a screen and other components such as keyboard section, CPU and/or GPU that may be generating heat. Examples of notebook computer 124 may include but are not limited to laptop computers, personal computers and the like.

The liquid cooling system 122 comprises the heat collecting element 126 arranged in a keyboard section 128 of the notebook computer 124. The heat collecting element 126 is arranged in the keyboard section 128 to enable absorption of heat generated in the keyboard section 128 by for example, a Central Processing Unit (CPU) or a Graphics Processing Unit (GPU). The heat is absorbed in the fluid 110.

The liquid cooling system 122 comprises the heat dissipating element 102, arranged in a screen section 108 of the notebook computer 124. The heat dissipating element 102 has a gap for movement of the fluid 110 received from the heat collecting element 126. The fluid 110 is circulated in a loop to transfer heat in the fluid 110 to the screen section 108 where the heat is dissipated into the ambient.

The liquid cooling system 122 comprises the micropump 130 configured to move fluid 110 in a closed loop from the heat collecting element 126 though the heat dissipating element 102 and back to the heat collecting element 126. The micropump 130 is configured to move the heated fluid 110 from the heat collecting element 126 to the heat dissipating element 102 where the fluid 110 is cooled.

According to an embodiment, the cooling system 122 may include pipelines or micro-tubes to transport the fluid 110 between the screen section 108, the keyboard section 128 and the micropump 130.

In an example, a conventional heat dissipating element may have a volume of 12700 cubic millimeter, pressure losses of 2700 Pa and thermal performances of 47 degrees Celsius at an inlet and thermal performances of 35.4 degrees Celsius at conventional outlet. The heat dissipating element 102 may have a volume of 5915 cubic millimeter, pressure losses of 5000 Pa and thermal performances of 47 degrees Celsius at an inlet and thermal performances of 35.4 degrees Celsius at outlet 112. In comparison to conventional designs of heat dissipating element, the heat dissipating element 102 of the present disclosure has reduced volume by 50% in comparison to the conventional design (i.e., which have full coverage of the desktop back cover). However, the thermal performance is not changed for the heat dissipating element 102 of the present disclosure. Therefore, the thermal efficiency is not reduced with the reduction of volume of the heat dissipating element 102 (i.e. weight) reduction. Further, the increase from 2.7kPa to 5kPa in the present disclosure is an acceptable rising with making no additional problems for the micropump 130 which may overcome the total pressure losses of the loop up to 50kPa or higher.

Beneficially, the heat dissipating element 102 has an additional advantage in comparison to conventional ones due to an absence of the bypassing part of the fluid 110. The conventional heat dissipating element is not optimized, as a part of a conventional fluid finds a way to exit the conventional heat dissipating element with still relatively high temperature (above ambient temperature level). Thus conventionally, there is reduced thermal efficiency which leads to rise in a whole cooling loop operation temperature. In the present disclosure, all the fluid 110 has chance to cool down to the ambient temperature level and thus avoids the bypass flow problem.

The liquid cooling system 122 of the present disclosure provides an improved thermal performance, i.e. the fluid 110, used for absorbing heat of the notebook computer 124 is cooled to an ambient temperature level. Thus, in comparison to conventional liquid cooling system no fluid 110 with relatively high temperature (i.e., above ambient temperature level) returns for heat absorption. As a result, the cooling system 122 provides improved cooling. Beneficially, the heat dissipating element 102 of the present disclosure provides even heat distribution i.e., spreading of heat from fluid 110 is even throughout the screen section 108. Further, there is reduced total weight of the heat dissipating element 102 of the present disclosure in comparison to conventional heat dissipating element. Further, there are controlled pressure losses with increased mechanical strength. Beneficially, the heat dissipating element 102 design instead of conventional snake-shape or U-shape heat dissipating unit designs allows to keep the pressure drops of the cooling system 122 at the acceptable level for given micropump performances.

FIG. 2 is an illustration of a screen section with a heat dissipating element for a notebook computer, in accordance with an embodiment of the present disclosure. FIG. 2 is described in conjunction with elements from FIG. 1A, IB and 1C. With reference to FIG. 2, there is shown an illustration 200 of the screen section 108 of the notebook computer 124. There is shown a substantially diagonal path 202, a substantially vertical path 204, an upper free triangle 206, a top comer 208, a lower free triangle 210, a lower edge 212.

According to an embodiment, the rising section such as rising section 116 is arranged to follow a substantially diagonal path 202 from the inlet such as the inlet 104 to an opposite top comer such as the top comer 118 of the screen section 108. In other words, the heat dissipating element 102 forms a right triangle wherein the inlet 104 is arranged along a hy potenuse. The substantially diagonal path 202 provides a direction of flow of the fluid 110. By virtue of the substantially diagonal path 202, heat of the fluid 110 is dissipated by the screen section 108. The screen section 108 is heated evenly along the substantially diagonal path 202, i.e. spreading the heat that heated fluid 110 carries. The heated screen section 108 further dissipates the heat into environment. According to an embodiment, the falling section such as falling section 120 is arranged to follow a substantially vertical path 204 from the rising section 116 to the outlet such as the outlet 112. In other words, the heat dissipating element 102 forms a right triangle where the falling section 120is arranged along a vertical leg. Before the fluid 110 goes out to the keyboard section 128, the fluid 110 flowing in the substantially vertical path 204 is cooled down to the ambient temperature level. Thus, there is improved thermal performance.

According to an embodiment, the screen section 108 comprises an upper free triangle 206 which is not covered by a heat dissipating element such as the heat dissipating element 102, arranged in a top comer 208 of the screen section 108 above the inlet 104. By virtue of the upper free triangle 206, a weight of the heat dissipating element 102 and a weight of the fluid 110 is reduced. Thus, there is no need to ensure a full area of the screen section 108 to be in contact with the heat dissipating element 102, in comparison with conventional liquid cooling systems.

According to an embodiment, a lower free triangle 210 of the screen section 108 is not covered by the heat dissipating element 102, arranged on a lower edge 212 of the screen section 108 between the inlet 104 and the outlet 112. In other words, there are two triangle sections, one that is below the heat dissipating element 102, i.e., lower free triangle 210, and one that is above the heat dissipating element 102, i.e., upper free triangle 206. These two triangle sections are free for dissipating heat into the environment. Thus, a total weight of the heat dissipating element 102 is reduced compared to the traditionally designed S-shape or U- shape heat dissipating units.

FIG. 3A is an illustration of a heat dissipating element, in accordance with an embodiment of the present disclosure. FIG. 3A is described in conjunction with elements from FIG. 1A, IB and 1C. With reference to FIG. 3A, there is shown an illustration 300A of the heat dissipating element 102. There is shown a flat sheet 302 and a shaped sheet 304.

The flat sheet 302 may also be referred to as a top plate having flat surface. The shaped sheet 304 may also be referred to as a bottom plate having surface with pillars. The flat sheet 302 and the shaped sheet 304 may be made of metals and have a gap between them for a flow of the fluid 110. The shaped sheet 304 having inner pillars, support the flat sheet 302 and the shaped sheet 304 and thus avoids collapse or expansion, due to inner pressure variations that may occur across the liquid cooling system operation range. Further, the two sheets i.e., the flat sheet 302 and the shaped sheet 304 ensure a suitable contact is established between the heat dissipating element 102 and the screen section 108.

FIG. 3B is an illustration of a side view of a heat dissipating element in a screen section of a notebook computer, in accordance with an embodiment of the present disclosure. FIG. 3B is described in conjunction with elements from FIG. 1A, IB, 1C and 3A. With reference to FIG. 3B, there is shown an illustration 300B of the heat dissipating element 102 in the screen section 108. The heat dissipating element 102 shown in this FIG. 3B has the flat sheet 302 and the shaped sheet 304 which are integrated to form the heat dissipating element 102.

FIG. 3C is a cross-sectional view of a heat dissipating element, in accordance with an embodiment of the present disclosure. FIG. 3C is described in conjunction with elements from FIG. 1 A, IB, 1C, 3A and 3B. With reference to FIG. 3C, there is shown a cross-section view 300C of the heat dissipating element 102 along the line A-A’ in the FIG. 3B. There is shown the flat sheet 302, the shaped sheet 304, a channel 306, a cover 308 and a plurality of pillars 310A, 310B, 310C, 310D and 310E.

According to an embodiment, the heat dissipating element 102 comprises a flat sheet 302 and a shaped sheet 304 forming a channel 306 for the rising section 116 and the falling section 120. The channel 306 enables movement of the fluid 110. Thus, heat in the fluid 110 flowing through the channel 306 is dissipated via the screen section 108 in the rising section 116. Further, the fluid 110 flowing through the channel 306 is cooled in the falling section 120.

According to an embodiment, one of the flat sheet 302 and the shaped sheet 304 is formed integrally with a cover 308 of the screen section 108. In this case, the heat dissipating element 102 is made of two metal compartments, one is made of metal sheet (such as the flat sheet 302 with thickness of about a hundred microns), the other plate (such as the shaped sheet 304) is integrated with the cover 308 such as a metal back cover, onto its inner surface (opposite to a surface in contact ambient). In other words, walls of the heat dissipating element 102 is replaced with the cover 308, i.e. supports are machined (or etched) on the inner surface of the cover 308 so that the inner surface operates as the other wall of the heat dissipating element 102 and provides mechanical structure support to the heat dissipating element 102. Thus, there is an overall saving on weight of the cooling system 122. According to an embodiment, the shaped sheet 304 comprises a plurality of pillars 310A, 310B, 310C, 310D and 310E formed within the channel 306 and configured to contact the flat sheet 302 and support the channel 306. In an example, a channel is formed between the pillars 310A and 310B, another channel is formed between the pillars 310B and 310C, yet another channel is formed between the pillars 310C and 310D, another channel is formed between the pillars 310D and 310E. The plurality of pillars 310A, 310B, 310C, 310D and 310E each provide mechanical strength to the channel 306. Beneficially, the mechanical strength ensures stable thermal contact with the cover 308 within a whole operation of heat dissipation.

According to an embodiment, one or more edges of the channel 306 and the plurality of pillars 310A, 310B, 310C, 310D and 310E are attached to the flat sheet 302 by a laser welding process. The laser welding process is used for combining the two sections i.e., the pillars 310A, 310B, 310C, 310D, 310E and the flat sheet 302 in a way that the pillars top surface forms a connection region. In an example, the laser welding process is used also along the one or more edges i.e., peripheral edges, in order to form a closed gap (cavity or channel), which is sealed and thus protects from a leakage risk of the fluid 110.

The heat dissipating element 102 has an inner pressure which might be either above ambient pressure or below or equal to ambient pressure. In all these cases the heat dissipating element 102 does not lose its shape and ensures good thermal contact with the metal desktop cover. The plurality of pillars 310A, 310B, 310C, 310D and 310E ensures that there is no warpage (bulges or dimples) in the surface area within the whole operation pressure range from one side. Thus, there is good thermal contact with the metal desktop cover. Further, from other side, the plurality of pillars 310A, 310B, 310C, 310D and 310E lead to increased pressure losses of the fluid 110 to pass through the heat dissipating element 102.

Therefore, the plurality of pillars 310A, 310B, 310C, 310D and 310E are well-designed from the trade-off point of view between the inner pressure losses of the fluid 110 and mechanical strength of the walls of the heat dissipating element 102 in order to ensure surface flatness (i.e. good thermal contact with the metal desktop cover) within the whole operation range. As the total thickness of the heat dissipating element 102 hardly exceeds hundreds of microns, thus there are thin walls that might be fabricated from metal sheets. As a result, the plurality of pillars 310A, 310B, 310C, 310D and 310E prevent any deformations of the heat dissipating element 102.

FIG. 4A is an illustration of a shape of plurality of pillars of a shaped sheet of a heat dissipating element, in accordance with an embodiment of the present disclosure. FIG. 4A is described in conjunction with elements from FIG. 1A, IB, 1C, 3 A, 3B and 3C. With reference to FIG. 4A, an illustration 400A of a shape of a pillar of the plurality of pillars 310A, 310B, 310C, 310D and 310E. There is shown a first pillar 402 having a round shape, a second pillar 404 having a capsule shape, a third pillar 406 having an elongated wall shape.

According to an embodiment, the plurality of pillars 310A, 310B, 310C, 310D and 310E are formed to have a round shape, a capsule shape or an elongated wall shape. The first pillar 402 having the round shape allows to get lowest pressure drops for given thermal performances of the heat dissipating element 102. Such round shape pillars can be replaced with segment pillars, i.e. capsule shaped pillars. The second pillar 404 having a capsule shape facilitate joining of two sections (i.e., the flat sheet 302 and the shaped sheet 304) of the heat dissipating element 102. Alternatively, the segment pillars can be prolonged to organize longitudinal shape pillars, i.e. the third pillar 406. In such pillars grooves provide an arrangement for the fluid path. In an example, the round shape, the capsule shape and the elongated wall shape are used here for exemplary purpose and any suitable shape may be used for the plurality of pillars 310A, 310B, 310C, 310D and 310E.

FIG. 4B is an illustration of a three-dimensional view of a shaped sheet comprising pillars having capsule shape, in accordance with an embodiment of the present disclosure. FIG. 4A is described in conjunction with elements from FIG. 1A, IB, 1C, 3A, 3B, 3C and 4A. With reference to FIG. 4B, there is shown an illustration 400B of the shaped sheet 304 comprising pillars having capsule shape. The shaped sheet 304 of the present disclosure comprises the pillars such as the second pillar 404 having the capsule shape.

FIG. 4C is an illustration of a three-dimensional view of a shaped sheet comprising pillars having elongated wall shape, in accordance with an embodiment of the present disclosure. FIG. 4C is described in conjunction with elements from FIG. 1A, IB, 1C, 3A, 3B, 3C and 4A. With reference to FIG. 4C, there is shown an illustration 400C of the shaped sheet 304 comprising pillars having elongated wall shape. The shaped sheet 304 of the present disclosure comprises the pillars such as the third pillar 406 having the elongated wall shape. FIG. 5A is an illustration of a shaped sheet formed by etching process, in accordance with an embodiment of the present disclosure. FIG. 5A is described in conjunction with elements from FIG. 3A, 3B, 3C and 4A. With reference to FIG. 5A, there is shown an illustration 500A of the shaped sheet 304 formed by the etching process.

According to an embodiment, the shaped sheet 304 is formed by an etching process. In an example, the shaped sheet 304 herein has a plurality of pillars such as the first pillar 402 having the round shape. The etching process is used to provide the desired shape such as a round shape, a capsule shape or an elongated wall shape to the pillars of the shaped sheet 304. The shaped sheet 304 formed by the etching process have improved thermal efficiency with respect to their better ability to transfer heat via its solid bodies.

FIG. 5B is an illustration of a shaped sheet formed by stamping process, in accordance with an embodiment of the present disclosure. FIG. 5B is described in conjunction with elements from FIG. 3A, 3B, 3C and 4A. With reference to FIG. 5B, there is shown an illustration 500B of the shaped sheet 304 formed by the stamping process.

According to an embodiment, the shaped sheet 304 is formed by a stamping process. The etching fabrication process is replaced with the stamping process to enable reduction in weight of the heat dissipating element 102. In an example, the shaped sheet 304 herein has a plurality of pillars such as the first pillar 402 having the round shape. The first pillar 402 in the FIG. 5B may have a deformed round shape (i.e. diameter may be different for two perpendicular directions) in comparison to the first pillar 402 in the FIG. 5A which have regular round shape. The first pillar 402 formed by stamping may have sloping sides, forming a truncated cone shape. The shaped sheet 304 formed by the stamping process has an empty space inside, the main solid body is replaced with air. Thus, there may be reduced heat transfer abilities in comparison to shaped sheet 304 formed by the etching process. In an example, the etching process and the stamping process are used here for exemplary purpose and any suitable process may be used for forming the shaped sheet 304.

Beneficially, a variable pillars design allows to select a cheaper fabrication process. Further, the variable pillars design allows to arrange optimal inner path of the fluid 110 based on the specific boundaries of the liquid cooling system 122. FIG. 6 is an illustration of a heat dissipating element having high conductivity plate, in accordance with an embodiment of the present disclosure. FIG. 6 is described in conjunction with elements from FIG. 1A, IB and 1C. With reference to FIG. 6, there is shown an illustration 600 of the heat dissipating element 102. There is shown a high conductivity plate 602, the heat dissipating element 102, the lower corner 106 and the screen section 108.

According to an embodiment, the heat dissipating element 102 further comprises a high conductivity plate 602 having a lateral heat conductivity greater than 500W/mk. The heat dissipating element 102 having high conductivity plate 602 is useful when a metallic back cover of a given notebook laptop has limited heat spreading capability due to either being thin or being made of an alloy with low thermal conductivity or both. In an example, the lateral heat conductivity is along a material plane of the high conductivity plate 602.

According to an embodiment, the high conductivity plate 602 is arranged to cover the lower comer 106 of the screen section 108 where the inlet 104 is located. Beneficially, the high conductivity plate 602 enables in spreading heat along an area of liquid entrance (where the fluid 110 has highest temperature). Thus, there is reduction in a maximum temperature of the hot spot region. In an example, the high conductivity plate 602 may be placed along a whole heat dissipating element 102 for improved thermal performance.

The heat dissipating element 102 is integrated with the high conductivity plate 602 such as a graphite sheet attached to the inlet 104 section area of the heat dissipating element 102. The graphite sheet has high thermal conductivity in lateral direction (600W/mK - 800W/mK). In an example, the graphite sheet has a thickness of 50 micrometres. Such graph ite sheet spreads heat flux along its surface. Further, there is reduction of maximum temperature of hot spot region.

FIG. 7 is a flowchart of a method of manufacturing a heat dissipating element for a notebook computer cooling system, in accordance with an embodiment of the present disclosure. FIG. 7 is described in conjunction with elements from FIG. 1A, IB, 1C, 3A, 3B and 3C. With reference to FIG. 7 there is shown the method 700. The method 700 includes steps 702 and 704.

In another aspect, the present disclosure provides a method 700 of manufacturing a heat dissipating element 102 for a notebook computer 124 cooling system 122, comprising: forming a rising section 116 to carry fluid 110 from an inlet 104 arranged in a lower comer 106 of a screen section 108 of the notebook computer 124 to an opposite top comer such as top comer 118 of the screen section 108; and forming a falling section 120 arranged to carry the fluid 110 from the rising section 116 to an outlet 112 arranged in an opposite lower comer 114 of the screen section 108.

At step 702, the method 700 comprises forming a rising section 116 to carry fluid 110 from an inlet 104 arranged in a lower comer 106 of a screen section 108 of the notebook computer 124 to an opposite top comer such as top comer 118 of the screen section 108. The rising section 116 is formed to carry the fluid 110 to enable dissipation of heat in the fluid 110 by the screen section 108, i.e. back cover, of the notebook computer 124. Further, more the surface of the back cover is heated up, more efficiently heat dissipation is executed. Due to the thermal conductivity of a metal back cover, the back cover is heated evenly along the inlet 104, i.e. spreading the heat that heated fluid 110 carries. The heated back cover further dissipates the heat into environment.

At step 704, the method 700 comprises forming a falling section 120 arranged to carry the fluid 110 from the rising section 116 to an outlet 112 arranged in an opposite lower comer 114 of the screen section 108. Before the fluid 110 goes out to the keyboard section 128, the fluid 110 is cooled down to the ambient temperature level to avoid the case where heated fluid 110 returns to the keyboard section 128. Thus, the present disclosure provides a design of the outlet 112 as an extended downward region i.e., falling section 120. Beneficially, this falling section 120 allows fluid 110 to flow down with big contact area with the back cover to enable the fluid 110 to be cooled down to room temperature level.

According to an embodiment, the method 700 further comprises using a flat sheet 302 and a shaped sheet 304 to form a channel 306 forming the rising section 116 and the falling section 120. The channel 306 enables movement of the fluid 110. Thus, heat in the fluid 110 flowing through the channel 306 is dissipated via the screen section 108 in the rising section 116. Further, the fluid 110 flowing through the channel 306 is cooled in the falling section 120.

According to an embodiment, the method 700 further comprises forming one of the flat sheet 302 and the shaped sheet 304 integrally with a cover 308 of the screen section 108. In this case, the heat dissipating element 102 is formed of two metal compartments, one is made of metal sheet (such as the flat sheet 302 with thickness of about a hundred microns), the other plate (such as the shaped sheet 304) is integrated with the cover 308 such as a metal back cover, onto its inner surface (opposite to a surface in contact ambient). In other words, walls of the heat dissipating element 102 is replaced with the cover 308, i.e. supports are machined (or etched) on the inner surface of the cover 308 so that the inner surface operates as the other wall of the heat dissipating element 102 and provides mechanical structure support to the heat dissipating element 102. Thus, there is an overall saving on weight.

According to an embodiment, in the method 700, the shaped sheet 304 is formed with a plurality of pillars 310A, 310B, 310C, 310D and 310E within the channel 306 and configured to contact the flat sheet 302 and support the channel 306. Thus, by virtue of the plurality of pillars 310A, 310B, 310C, 310D and 310E mechanical strength is provided to the channel 306. Beneficially, the mechanical strength ensures stable thermal contact with the metal back cover within a whole operation of heat dissipation.

According to an embodiment, the method 700 further comprises attaching one or more edges of the channel 306 and the plurality of pillars 310A, 310B, 310C, 310D and 310E to the flat sheet 302 using a laser welding process. The laser welding process is used for combining the two sections, i.e. the pillars 310A, 310B, 310C, 310D, 310E, and the flat sheet 302 in a way that the pillars top surface forms a connection region. In an example, the laser welding process is used also along the one or more edges, i.e. peripheral edges, in order to form a closed gap (cavity or channel).

According to an embodiment, in the method 700, the plurality of pillars 310A, 310B, 310C, 310D and 310E is formed to have a round shape, a capsule shape or an elongated wall shape. The plurality of pillars 310A, 310B, 310C, 310D and 310E having the round shape allows to get lowest pressure drops for a given thermal performances of the heat dissipating element 102. The plurality of pillars 310A, 310B, 310C, 310D and 310E having a capsule shape facilitate joining of two sections (i.e., the flat sheet 302 and the shaped sheet 304) of the heat dissipating element 102. Alternatively, the capsule shaped pillars can be prolonged to organize longitudinal shape pillars. In such pillars grooves provide an arrangement for the fluid path. In an example, the round shape, the capsule shape and the elongated wall shape are used here for exemplary purpose and any suitable shape may be used for the plurality of pillars 310A, 310B, 310C, 310D and 310E. According to an embodiment, in the method 700, the shaped sheet 304 is formed by an etching process or a stamping process. The etching process or stamping process are used to provide the desired shape such as a round shape, a capsule shape or an elongated wall shape to the pillars of the shaped sheet 304. The shaped sheet 304 formed by the etching process have improved thermal efficiency with respect to their better ability to transfer heat via its bodies. The stamping process may be used instead of the etching process to enable reduction in weight of the heat dissipating element 102. In an example, the etching process and the stamping process are used here for exemplary purpose and any suitable process may be used for forming the shaped sheet 304.

The method 700 of the present disclosure provides an improved thermal performance, i.e. the fluid 110 used for absorbing heat of the notebook computer 124 is cooled to an ambient temperature. Thus, in comparison to conventional methods no fluid 110 with relatively high temperature (i.e. above ambient temperature level) returns for heat absorption. As a result, the method 700 provides improved cooling performance. Beneficially, the heat dissipating element 102 of the present disclosure provides even heat distribution, i.e. spreading of heat from fluid 110 is even throughout the screen section 108. Further, there is reduced total weight of the heat dissipating element 102 of the present disclosure in comparison to conventional heat dissipating element. Further, there are controlled pressure losses with increased mechanical strength.

There is shown a table 1 providing values of different parameters for a first conventional heat dissipating element, the heat dissipating element 102 of the present disclosure and a second conventional heat dissipating element. The first conventional heat dissipating element occupies a complete area of a screen section and has area of 31726 square millimeters and perimeter of 801 millimeters. The second conventional heat dissipating element has a snake type shape and has area of 19464 square millimeters and perimeter of 3268 millimeters. The heat dissipating element 102 of the present disclosure has area of 14762 square millimeters and perimeter of 864 millimeters.

Table 1

Modifications to embodiments of the present disclosure described in the foregoing are possible without departing from the scope of the present disclosure as defined by the accompanying claims. Expressions such as "including", "comprising", "incorporating", "have", "is" used to describe and claim the present disclosure are intended to be construed in a nonexclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural. The word "exemplary" is used herein to mean "serving as an example, instance or illustration". Any embodiment described as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments and/or to exclude the incorporation of features from other embodiments. It is appreciated that certain features of the present disclosure, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the present disclosure, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable combination or as suitable in any other described embodiment of the disclosure.