Title:
HEAT-DISSIPATING GREASE
Document Type and Number:
WIPO Patent Application WO/2024/042956
Kind Code:
A1
Abstract:
This heat-dissipating grease comprises a matrix component and a filler component. The matrix component comprises a silicone A and a surfactant B, and the filler component comprises a filler D1 with a thermal conductivity of at least 20 W/m·k and a silica D2. The content of the silica D2 is 0.1 to 10 mass% with reference to the total amount of the filler component.
Inventors:
IGARASHI KAZUYUKI (JP)
IWASAKI TAKAYUKI (JP)
IWASAKI TAKAYUKI (JP)
Application Number:
PCT/JP2023/026975
Publication Date:
February 29, 2024
Filing Date:
July 24, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L23/373; C08F8/42; H01L23/36
Domestic Patent References:
| WO2020209263A1 | 2020-10-15 | |||
| WO2020080256A1 | 2020-04-23 |
Foreign References:
| JP2016216523A | 2016-12-22 | |||
| JP2020059842A | 2020-04-16 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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