Title:
HEAT-DISSIPATING MEMBER AND METHOD FOR MANUFACTURING HEAT-DISSIPATING MEMBER
Document Type and Number:
WIPO Patent Application WO/2014/061266
Kind Code:
A1
Abstract:
This heat-dissipating member (1) is provided with: a base sheet (2) having a porous matrix, which comprises a fluorine resin and a heat-conducting filler, as the base; and multiple adhesive sections (3) disposed on one of the main surfaces of the base sheet (2), the sections being separated from each other. The fluorine resin of the base sheet (2) comprises polytetrafluoroethylene. The area of the one main surface of the base sheet (2) that is covered by the multiple adhesive sections (3) is 10% - 85% of the area of the one main surface of the base sheet (2). On the one main surface of the base sheet (2), the multiple adhesive sections (3) are disposed so as to form passageways (5) that are continuous from one edge of the base sheet to the other edge. As a result, the heat-dissipating member (1) has good heat-dissipating properties.
Inventors:
TAGAWA KENICHI (JP)
NAITO TOMONARI (JP)
TAKAYAMA YOSHINARI (JP)
NAITO TOMONARI (JP)
TAKAYAMA YOSHINARI (JP)
Application Number:
PCT/JP2013/006131
Publication Date:
April 24, 2014
Filing Date:
October 15, 2013
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/30; C08K3/00; C08L27/12; C09J7/24; C09K3/00; C09K5/08; B32B3/14
Domestic Patent References:
| WO2010055878A1 | 2010-05-20 |
Foreign References:
| JP2002319653A | 2002-10-31 | |||
| JP2008303279A | 2008-12-18 | |||
| JP2008208159A | 2008-09-11 |
Attorney, Agent or Firm:
KAMADA, Koichi et al. (JP)
Koichi Kamata (JP)
Koichi Kamata (JP)
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