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Title:
HEAT-DISSIPATING POWDER COATING COMPOSITION, HEAT-DISSIPATING COATING FILM, AND COATED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2014/136615
Kind Code:
A1
Abstract:
A heat-dissipating powder coating composition according to one embodiment of the present invention contains at least one binder resin (A) selected from the group consisting of an epoxy resin (a1) and a polyester resin (a2) having a hydroxy group and/or a carboxyl group, and also contains a heat-dissipating filler (B) having a heat conductivity of 0.2 W/mK or more and less than 100 W/mK in an amount of 10 to 40 mass% inclusive. The heat-dissipating powder coating composition can be used as a material for a coating film that can be formed on the surfaces of various articles and has excellent heat dissipation efficiency.

Inventors:
IWAMURA EIJI (JP)
KOBAYASHI MASAKI (JP)
KOMIYAMA HIROFUMI (JP)
TAKAHASHI NAOYA (JP)
Application Number:
PCT/JP2014/054523
Publication Date:
September 12, 2014
Filing Date:
February 25, 2014
Export Citation:
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Assignee:
PELNOX LTD (JP)
International Classes:
C09D163/00; B05D7/24; B32B27/18; C09D5/03; C09D7/61; C09D163/02; C09D163/04; C09D167/00
Domestic Patent References:
WO2013129677A12013-09-06
Foreign References:
JPS6055066A1985-03-29
JPS5679161A1981-06-29
JP2009179700A2009-08-13
JP2004067828A2004-03-04
JP2010155893A2010-07-15
JPH03160064A1991-07-10
JP2008056865A2008-03-13
JPS6086175A1985-05-15
JPH09249737A1997-09-22
JP2003055614A2003-02-26
JP2004027146A2004-01-29
JP2012072294A2012-04-12
JP2004002792A2004-01-08
JPH1180610A1999-03-26
JPS5945365A1984-03-14
JP2009067998A2009-04-02
JPH08134263A1996-05-28
JP2013014670A2013-01-24
JP2013500351A2013-01-07
Attorney, Agent or Firm:
KOUNO, HIROAKI (JP)
Hiroaki Kono (JP)
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