Title:
HEAT DISSIPATING SHEET
Document Type and Number:
WIPO Patent Application WO/2024/019106
Kind Code:
A1
Abstract:
Provided is a flexible heat dissipating sheet having excellent electromagnetic shielding properties and heat dissipating properties. This heat dissipating sheet 1 includes an electrically conductive adhesive layer 2, and heat dissipating films 3, 4 respectively formed on opposite sides of the electrically conductive adhesive layer 2, wherein the electrically conductive adhesive layer 2 contains an electrically conductive filler and a binder component, and the heat dissipating films 3, 4 contains a thermally conductive filler and a binder component. The size of an uneven shape formed between the heat dissipating film 3 and at least one surface of the electrically conductive adhesive layer 2 is preferably 1-50 μm. A dendrite-shaped and/or flake-shaped material is preferably included as the electrically conductive filler.
Inventors:
HARUNA YUUSUKE (JP)
TAJIMA HIROSHI (JP)
TAJIMA HIROSHI (JP)
Application Number:
PCT/JP2023/026539
Publication Date:
January 25, 2024
Filing Date:
July 20, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H01L23/36; B32B7/12; B32B27/20; H01L23/00; H01L23/373; H05K7/20; H05K9/00
Foreign References:
| JP2002198686A | 2002-07-12 | |||
| JP2016186972A | 2016-10-27 | |||
| JP2018129498A | 2018-08-16 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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