Title:
HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING HEAT DISSIPATING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/153780
Kind Code:
A1
Abstract:
An electronic apparatus according to various embodiments disclosed herein may comprise: a printed circuit board; an electronic component disposed on the printed circuit board; a shield can that is disposed on the printed circuit board and includes an opening facing at least a portion of the electronic component; a support structure that is disposed between the printed circuit board and the shield can and supports the shield can; a contact member that is at least partially located in the opening and covers a portion of the electronic component; a sheet member that includes a first region corresponding to the opening and a second region other than the first region and covers the contact member and the shield can; a first heat transfer member disposed on the sheet member; a second heat transfer member disposed on the sheet member and spaced apart from the first heat transfer member; a cover member covering the first heat transfer member and the second heat transfer member; and a protrusion part that overlaps the second region of the sheet member when viewed in the direction of the printed circuit board from the cover member.
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Inventors:
YOON JONGGEUN (KR)
AN YONGHEE (KR)
LIM SUNGWOO (KR)
LIM CHANKYU (KR)
AN YONGHEE (KR)
LIM SUNGWOO (KR)
LIM CHANKYU (KR)
Application Number:
PCT/KR2023/001784
Publication Date:
August 17, 2023
Filing Date:
February 08, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; H05K9/00
Foreign References:
| KR20210063824A | 2021-06-02 | |||
| JP2016096249A | 2016-05-26 | |||
| CN111123291A | 2020-05-08 | |||
| KR20160096927A | 2016-08-17 | |||
| CN110325019A | 2019-10-11 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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