Title:
HEAT DISSIPATING STRUCTURE OF IN-VEHICLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/010655
Kind Code:
A1
Abstract:
Provided is a heat dissipating structure, which is of an in-vehicle device and
dissipates heat from a heat source (3) arranged in a case to the outside of the case
through a heat pipe (2). In the heat dissipating structure, the heat source (3)
is arranged at a lower section of a heat pipe (3) in the gravity direction, and the
heat pipe (3) is embedded in a case rear panel (1).
Inventors:
SAITOU YASUO (JP)
KOBAYASHI TAKASHI (JP)
KOBAYASHI TAKASHI (JP)
Application Number:
PCT/JP2006/308215
Publication Date:
January 25, 2007
Filing Date:
April 19, 2006
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
SAITOU YASUO (JP)
KOBAYASHI TAKASHI (JP)
SAITOU YASUO (JP)
KOBAYASHI TAKASHI (JP)
International Classes:
B60R16/02; H05K7/20
Foreign References:
| JP2000253538A | 2000-09-14 | |||
| JP2005144985A | 2005-06-09 | |||
| JP2001057492A | 2001-02-27 | |||
| JP2004116864A | 2004-04-15 | |||
| JPH0847113A | 1996-02-16 | |||
| JP2000349213A | 2000-12-15 | |||
| JPH08169284A | 1996-07-02 | |||
| JP2004235657A | 2004-08-19 |
Attorney, Agent or Firm:
TAZAWA, Hiroaki et al. (7-1 Kasumigaseki 3-chome, Chiyoda-k, Tokyo 13, JP)
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