Title:
HEAT-DISSIPATING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/190559
Kind Code:
A1
Abstract:
An aspect of the present disclosure provides a heat-dissipating structure including an electric circuit device including a heat-generating element and heatsinks provided on both principal surfaces of the heat-generating element, a pair of coolers stacked on the heatsinks via respective insulating plates, and clamps that hold the electric circuit device, the insulating plates, and the coolers in a pressurized state in the stacking direction, wherein the insulating plates include a porous nitride sintered plate and a resin filling the pores of the nitride sintered plate, and the thermal resistance in the stacking direction is 0.30°C/W or less.
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Inventors:
INOUE SAORI (JP)
SHIHODO MASUMI (JP)
KOGA RYUJI (JP)
KICHISE RIHOKO (JP)
KANEKO ERI (JP)
SHIHODO MASUMI (JP)
KOGA RYUJI (JP)
KICHISE RIHOKO (JP)
KANEKO ERI (JP)
Application Number:
PCT/JP2023/012597
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L23/36; H01L23/373; H01L23/40
Domestic Patent References:
| WO2018025933A1 | 2018-02-08 | |||
| WO2021200967A1 | 2021-10-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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