Title:
HEAT-DISSIPATING SUBSTRATE AND ELECTRICALLY DRIVEN POWER STEERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/094589
Kind Code:
A1
Abstract:
Provided are a heat-dissipating substrate and an electrically driven power steering device for improving the heat dissipation properties of an electronic component. In the heat-dissipating substrate, a plurality of thermal vias are disposed at least in an electronic component projection region in which a region of the bottom-surface part of an electronic component is projected on a mounting surface in a direction perpendicular to the mounting surface, and the surface density of the thermal vias per unit area of the mounting surface varies at least partially. The plurality of thermal vias are disposed so that the surface density of the thermal vias is greatest in a dense portion of the electronic component projection region inward of the edge section.
More Like This:
Inventors:
SHIMAKAWA SHIGERU (JP)
Application Number:
PCT/JP2016/084825
Publication Date:
June 08, 2017
Filing Date:
November 24, 2016
Export Citation:
Assignee:
NSK LTD (JP)
International Classes:
H05K1/02; B62D5/04; H01L23/12; H01L23/36
Foreign References:
| JP2004214460A | 2004-07-29 | |||
| JP2014170835A | 2014-09-18 | |||
| JP2002222897A | 2002-08-09 | |||
| JP2008182184A | 2008-08-07 | |||
| JP2006114606A | 2006-04-27 | |||
| JP2008010584A | 2008-01-17 | |||
| JP2012231061A | 2012-11-22 | |||
| JP2015018857A | 2015-01-29 |
Other References:
See also references of EP 3386277A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: