Title:
HEAT DISSIPATION APPARATUS, CIRCUIT BOARD, COMMUNICATION DEVICE, ELECTRONIC DEVICE, AND COMMUNICATION BASE STATION
Document Type and Number:
WIPO Patent Application WO/2024/037278
Kind Code:
A1
Abstract:
The present application provides a heat dissipation apparatus, a circuit board, a communication device, a communication base station, and an electronic device. The heat dissipation apparatus comprises a substrate (100) and at least one heat dissipation structure. Each heat dissipation structure comprises: a first heat dissipation fin group, comprising two first heat dissipation fins (200), wherein the two first heat dissipation fins (200) are connected to the substrate (100); and a second heat dissipation fin (300), connected to the two first heat dissipation fins (200), wherein the interiors of the second heat dissipation fin (300) and the two first heat dissipation fins (200) are communicated to form a heat dissipation flow channel.
Inventors:
LI DECHAO (CN)
ZHOU AILAN (CN)
GUO TIANSHENG (CN)
GUO HONGTAO (CN)
WANG YU (CN)
ZHOU AILAN (CN)
GUO TIANSHENG (CN)
GUO HONGTAO (CN)
WANG YU (CN)
Application Number:
PCT/CN2023/108591
Publication Date:
February 22, 2024
Filing Date:
July 21, 2023
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H05K7/20
Foreign References:
| CN114760803A | 2022-07-15 | |||
| CN110505791A | 2019-11-26 | |||
| CN1909771A | 2007-02-07 | |||
| CN2624402Y | 2004-07-07 | |||
| US20170311484A1 | 2017-10-26 |
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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