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Title:
HEAT DISSIPATION APPARATUS AND COMMUNICATION EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2022/199439
Kind Code:
A1
Abstract:
The present application provides a heat dissipation apparatus and communication equipment. The heat dissipation apparatus (3) comprises an accommodating portion (31) and a heat dissipation device assembly (32). The accommodating portion (31) has an accommodating cavity for accommodating a heating device (2). The heating device (2) is inserted into the accommodating cavity along a first direction. The heat dissipation device assembly (32) comprises a heat dissipation device (321), a support (322), sliding assemblies (323), and a linkage portion (324). The support (322) is fixed to the accommodating portion (31). The heat dissipation device (321) is connected to the support (322) by means of the sliding assemblies (323). The accommodating portion (31) comprises a first side surface (311) and a second side surface (312) opposite to each other. The heat dissipation device is located on the first side surface (311). Each sliding assembly (323) comprises an oblique groove (3231) and a slider (3232). The oblique groove (3231) gradually approaches the second side surface (312) of the accommodating portion (31) along the first direction. One end of the linkage portion (324) is mounted on the heat dissipation device (321), and the other end is located in the accommodating cavity. When the heating device (2) is inserted into the accommodating cavity, the linkage portion (324) is triggered to drive the heat dissipation device (321) to move along the first direction, and the slider (3232) slides relative to the oblique groove (3231) to drive the heat dissipation device (321) to move in a direction close to the second side surface (312). When the heating device (2) is completely inserted into the accommodating portion (31), the heat dissipation device (321) is attached to the heating device (2). The reduction of the contact thermal resistance between the heat dissipation device (321) and the heating device (2) is facilitated.

Inventors:
LI XIAODONG (CN)
WANG JING (CN)
SUN YUKUO (CN)
Application Number:
PCT/CN2022/081129
Publication Date:
September 29, 2022
Filing Date:
March 16, 2022
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20; H05K7/14
Domestic Patent References:
WO2022057293A12022-03-24
Foreign References:
CN201038390Y2008-03-19
CN114269106A2022-04-01
CN109600954A2019-04-09
CN104979678A2015-10-14
CN105472938A2016-04-06
CN103811435A2014-05-21
CN207354477U2018-05-11
CN101207992A2008-06-25
EP3448138A12019-02-27
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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