Title:
HEAT DISSIPATION APPARATUS, CONNECTING STRUCTURE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/221638
Kind Code:
A1
Abstract:
Embodiments of the present application relate to a heat dissipation apparatus, a connecting structure, and an electronic device. A first heat dissipation device (110a) is in thermal contact with a first heating device (201a) on a first assembly (200a); a second heat dissipation device (110b) is in thermal contact with a second heating device (201b) on a second assembly (200b); the first heat dissipation device (110a) and the second heat dissipation device (110b) are communicated by means of a pipeline (120), and the three parts are filled with a refrigeration medium. Heat generated by either of the first heating device (201a) and the second heating device (201b) can be transferred, by means of the corresponding heat dissipation device, to the refrigeration medium in the heat dissipation device, and the heat is dissipated outwards from the surface of the heat dissipation device. When the heating devices on different assemblies have a certain temperature difference, the heat dissipation device corresponding to the high-temperature heating device transfers, by means of the refrigeration medium, heat to the heat dissipation device corresponding to the low-temperature or non-working heating device, so that an uniform-temperature heat dissipation effect for the first heating device (201a) and the second heating device (201b) on different assemblies is achieved, and the heat dissipation capability is improved. The heat dissipation apparatus (100) is low in cost, easy to implement, and easy to deploy, there is no need to arrange a large pump, a pipeline, a heat exchanger and the like in a machine room, and extra indoor space is not needed.
Inventors:
HE ZHI (CN)
LI CHUNRONG (CN)
YUAN BAOJUN (CN)
ZHANG ZHAO (CN)
LI CHUNRONG (CN)
YUAN BAOJUN (CN)
ZHANG ZHAO (CN)
Application Number:
PCT/CN2023/082503
Publication Date:
November 23, 2023
Filing Date:
March 20, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Domestic Patent References:
| WO2022100106A1 | 2022-05-19 |
Foreign References:
| CN216087384U | 2022-03-18 | |||
| CN113939138A | 2022-01-14 | |||
| CN106470537A | 2017-03-01 | |||
| CN114007372A | 2022-02-01 | |||
| CN111384011A | 2020-07-07 | |||
| US20190264986A1 | 2019-08-29 |
Attorney, Agent or Firm:
SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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