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Patent Searching and Data


Title:
HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/279757
Kind Code:
A1
Abstract:
A heat dissipation apparatus and an electronic device, comprising an evaporator (100), a condenser (300), a steam pipeline (200), and a return pipeline (400). The steam pipeline (200) is communicated with the evaporator (100) and the condenser (300), and is configured to convey a gas working medium obtained by evaporation of the evaporator (100) to the condenser (300); the return pipeline (400) is communicated with the condenser (300) and the evaporator (100), and is configured to convey a liquid working medium obtained by condensation of the condenser (300) to the evaporator (100); a liquid seal structure (410) is provided at one end of the return pipeline (400) in communication with the evaporator (100), and is configured to fill the liquid working medium to prevent the gas working medium inside the evaporator (100) from entering the return pipeline (400) by means of the liquid seal structure (410).

Inventors:
DUAN ZHIWEI (CN)
XU QINGSONG (CN)
LIU FAN (CN)
Application Number:
PCT/CN2022/080750
Publication Date:
January 12, 2023
Filing Date:
March 14, 2022
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
F28D15/02
Foreign References:
JP2001066080A2001-03-16
JP2004085151A2004-03-18
JP2002048484A2002-02-15
JPS6237689A1987-02-18
CN208887429U2019-05-21
CN101251347A2008-08-27
CN108592669A2018-09-28
JPS60188794A1985-09-26
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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