Title:
HEAT DISSIPATION APPARATUS FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/054082
Kind Code:
A1
Abstract:
The present invention relates to a heat dissipation apparatus for an electronic device. In particular, the heat dissipation apparatus comprises: a heat conduction panel body having formed therein a refrigerant flow space in which, while charged refrigerant changes in phase, gas-liquid circulation takes place; and an absorber which is disposed in the refrigerant flow space of the heat conduction panel body, and which distributes, while absorbing and holding the liquid refrigerant of the refrigerant, the liquid refrigerant in the direction of gravity or at least in a direction opposite to the direction of gravity, wherein, due to the material itself, the absorber prevents shape deformation in the direction of gravity even while maintaining the absorption rate for the liquid refrigerant, and thus, provided is the advantage of greatly improving overall heat dissipation performance.
Inventors:
KIM DUK YONG (KR)
LEE KANG HYUN (KR)
KIM JONG NAM (KR)
LEE KANG HYUN (KR)
KIM JONG NAM (KR)
Application Number:
PCT/KR2023/013472
Publication Date:
March 14, 2024
Filing Date:
September 08, 2023
Export Citation:
Assignee:
KMW INC (KR)
International Classes:
H05K7/20
Foreign References:
| JP2022030213A | 2022-02-18 | |||
| KR20120086001A | 2012-08-02 | |||
| JP2008103773A | 2008-05-01 | |||
| KR20150127473A | 2015-11-17 | |||
| KR20210119315A | 2021-10-05 |
Attorney, Agent or Firm:
SUAN INTELLECTUAL PROPERTY (KR)
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