Title:
HEAT DISSIPATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/039338
Kind Code:
A1
Abstract:
The present invention relates to a heat dissipation apparatus which conducts heat, generated in a PCB substrate by light emission of an LED, to a heat dissipation cover with high heat emissivity through a housing so as to effectively dissipate the heat. The heat dissipation apparatus of the present invention comprises: a heat sink that is coupled to the PCB substrate provided with a lighting unit in order to dissipate heat generated from the PCB substrate; and a heat dissipation cover that is molded from engineering plastic and coupled to the outside of the heat sink so as to surround the heat sink, and has a plurality of cilia protruding at set intervals and integrally formed on the outer surface thereof.
Inventors:
GONG DAEWEON (KR)
Application Number:
PCT/KR2021/000861
Publication Date:
February 24, 2022
Filing Date:
January 22, 2021
Export Citation:
Assignee:
PTG CO LTD (KR)
International Classes:
F21V29/74; F21K9/00; F21V23/00; F21Y115/10
Domestic Patent References:
| WO2014007411A1 | 2014-01-09 |
Foreign References:
| KR101971550B1 | 2019-04-23 | |||
| KR20110010409U | 2011-11-04 | |||
| KR200350219Y1 | 2004-05-14 | |||
| KR101464318B1 | 2014-11-25 |
Attorney, Agent or Firm:
HWANG, Yeong Ik (KR)
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