Title:
HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/021645
Kind Code:
A1
Abstract:
[Problem] To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. [Solution] Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450°C and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450°C.
Inventors:
GOTO DAISUKE (JP)
MIYAKAWA TAKESHI (JP)
ISHIHARA YOSUKE (JP)
MIYAKAWA TAKESHI (JP)
ISHIHARA YOSUKE (JP)
Application Number:
PCT/JP2015/072247
Publication Date:
February 11, 2016
Filing Date:
August 05, 2015
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
H01L23/12; H01L23/14; H01L23/36
Foreign References:
| JP2004047619A | 2004-02-12 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
Sonoda and the Kobayashi patent business corporation (JP)
Sonoda and the Kobayashi patent business corporation (JP)
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