Title:
HEAT DISSIPATION DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/193880
Kind Code:
A1
Abstract:
A heat dissipation device (70) includes a plurality of heat pipes (73) that are positioned above an integrated circuit (50a) and that each include a heat receiving part (73a) that is thermally connected to the integrated circuit (50a); and a heat sink (71) connected to the plurality of heat pipes (73). The plurality of heat receiving parts (73a) are arranged in the left-right direction, and each is in contact with the heat receiving part (73a) of the heat pipe (73) adjacent thereto. The heat receiving parts (73a) have a first width (W1) in the vertical direction, and a second width (W2) in the left-right direction, which is less than the width (W1). Due to this configuration, the performance of cooling the integrated circuit can be improved.
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Inventors:
SABELSTROM NILS (JP)
SASAKI CHIYOSHI (JP)
TSUCHIDA SHINYA (JP)
AOKI KEIICHI (JP)
OOTORI YASUHIRO (JP)
SASAKI CHIYOSHI (JP)
TSUCHIDA SHINYA (JP)
AOKI KEIICHI (JP)
OOTORI YASUHIRO (JP)
Application Number:
PCT/JP2021/012748
Publication Date:
September 30, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
SONY INTERACTIVE ENTERTAINMENT INC (JP)
International Classes:
H01L23/427; F28D15/02; H05K7/20
Domestic Patent References:
| WO2019131814A1 | 2019-07-04 | |||
| WO2014185311A1 | 2014-11-20 |
Foreign References:
| JPH06216554A | 1994-08-05 | |||
| JP2001166851A | 2001-06-22 | |||
| JP2017079306A | 2017-04-27 |
Other References:
See also references of EP 4131369A4
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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