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Title:
HEAT DISSIPATION DEVICE, AND HEAT DISSIPATION AND HEATING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/238245
Kind Code:
A1
Abstract:
A heat dissipation device (100) comprises a heat dissipation board (10). The heat dissipation board (10) is provided with a heat dissipation pipeline therein. The heat dissipation pipeline comprises a liquid feed pipe (11), a liquid discharge pipe (12) and multiple connection pipes (13). The liquid feed pipe (11) and the liquid discharge pipe (12) extend through the heat dissipation board (10) in a first direction, and one end of each is closed. The multiple connection pipes (13) extend through the heat dissipation board (10) in a second direction, and respective two ends thereof are closed. The multiple connection pipes (13) are arranged at intervals in the first direction. The respective two ends of the multiple connection pipes (13) are respectively in communication with the liquid feed pipe (11) and the liquid discharge pipe (12). A liquid can enter from one end of the liquid feed pipe (11), sequentially flow through the liquid feed pipe (11), the connection pipes (13) and the liquid discharge pipe (12), and exit from one end of the liquid discharge pipe (12).

Inventors:
LI RISHENG (CN)
LIU YUNFENG (CN)
WANG LIEDONG (CN)
XU JUN (CN)
Application Number:
PCT/CN2021/073161
Publication Date:
December 02, 2021
Filing Date:
January 21, 2021
Export Citation:
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Assignee:
HANGZHOU DARERUOHAN TECH CO LTD (CN)
International Classes:
H05K7/20; F28D21/00
Domestic Patent References:
WO2011005342A12011-01-13
Foreign References:
CN209768077U2019-12-10
CN106159378A2016-11-23
CN205623058U2016-10-05
CN108566761A2018-09-21
CN209748400U2019-12-06
Attorney, Agent or Firm:
METIS IP (CHENGDU) LLC (CN)
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