HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREFOR

Title:

HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2022/041961

Kind Code:

A1

Abstract:

The present application relates to the technical field of hardware heat dissipation, and provides a heat dissipation device and a manufacturing method therefor that can be applied to small computing devices configured on intelligent automobiles, autonomous driving automobiles, networked automobiles or electric automobiles. The heat dissipation device comprises a top layer, a plurality of plates of thermosyphon (PTS) structures, and a bottom substrate, wherein each PTS structure is provided between the top layer and the bottom substrate and is perpendicular to the top layer and the bottom substrate. Second cavities of the PTS structures enclosed by sidewalls are communicated with each other by means of a first cavity of the top layer. Refrigerants are mounted in the second cavities. By using the PTS structure (a special heat dissipation structure), the heat dissipation device can significantly improve the heat dissipation effect of the heat dissipation device. In addition, the cavities of the PTS structures are communicated with each other, such that the steam temperature in the cavity of each PTS structure tends to be uniform, which can effectively improve the heat dissipation performance of the heat dissipation device.

Inventors:

PENG YAOFENG (CN)

Application Number:

PCT/CN2021/100819

Publication Date:

March 03, 2022

Filing Date:

June 18, 2021

Export Citation:

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Assignee:

HUAWEI TECH CO LTD (CN)

International Classes:

H05K7/20

Foreign References:

CN105992487A	2016-10-05
CN103429061A	2013-12-04
CN111031748A	2020-04-17
CN109819635A	2019-05-28
CN110198611A	2019-09-03
US20180263138A1	2018-09-13
CN202010854526A	2020-08-24

Other References: