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Title:
HEAT DISSIPATION DEVICE AND METHOD FOR CONTROLLING SURFACE TEMPERATURE OF CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/032630
Kind Code:
A1
Abstract:
A heat dissipation device and a method for controlling the surface temperature of a circuit board. The device comprises: a heat dissipation structure (101), which is arranged parallel to the top of the circuit board, and is configured to dissipate heat from components on the circuit board; and an air blocking structure (102), which is arranged in an air inlet region of the circuit board, and is configured to block an airflow blowing directly to the surface of the circuit board and to direct the airflow to the surface of the heat dissipation structure (101).

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Inventors:
ZHANG LIGEN (CN)
DUAN YUBIN (CN)
ZHANG GUOXUAN (CN)
ZHANG BIN (CN)
WANG LINGUO (CN)
DAI LI (CN)
YANG ZHIQIANG (CN)
CHEN LIXIA (CN)
Application Number:
PCT/CN2023/111815
Publication Date:
February 15, 2024
Filing Date:
August 08, 2023
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
H05K7/20
Foreign References:
CN113038781A2021-06-25
CN111386003A2020-07-07
CN102467199A2012-05-23
CN108401401A2018-08-14
CN212970620U2021-04-13
CN201115064Y2008-09-10
US20210112682A12021-04-15
Attorney, Agent or Firm:
KANGXIN PARTNERS , P.C. (CN)
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