Title:
HEAT DISSIPATION DEVICE, METHOD FOR MOUNTING HEAT DISSIPATION DEVICE, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/188541
Kind Code:
A1
Abstract:
A heat dissipation device, a method for mounting the heat dissipation device, and a communication device. The heat dissipation device comprises a heat dissipation substrate (100) and a plurality of heat dissipation fins (200). The plurality of heat dissipation fins (200) are arranged on the heat dissipation substrate (100) in parallel. The heat dissipation fins (200) are bent to form heat dissipation flaps (210). Adjacent heat dissipation fins (200) are connected by means of the heat dissipation flaps (210), thereby forming an integral structure of the fins and a cover plate.
Inventors:
XIONG RUI (CN)
NIE ZHIDONG (CN)
LI SHUAI (CN)
LIU XIN (CN)
LIU FAN (CN)
NIE ZHIDONG (CN)
LI SHUAI (CN)
LIU XIN (CN)
LIU FAN (CN)
Application Number:
PCT/CN2022/071300
Publication Date:
September 15, 2022
Filing Date:
January 11, 2022
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H05K7/20; F28F3/00
Foreign References:
| CN2696123Y | 2005-04-27 | |||
| CN2414588Y | 2001-01-10 | |||
| CN201488624U | 2010-05-26 | |||
| CN2912203Y | 2007-06-13 | |||
| CN1411924A | 2003-04-23 | |||
| US20200232714A1 | 2020-07-23 |
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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