Title:
HEAT DISSIPATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/114823
Kind Code:
A1
Abstract:
A heat dissipation device, comprising: a housing; the housing comprises a first sub-housing and a second sub-housing; the second sub-housing is close to the bottom of the heat dissipation device, and the first sub-housing is close to the top of the heat dissipation device; one or more holes are provided on a part of the second sub-housing overlapping the first sub-housing, and the first sub-housing and the second sub-housing can move relative to each other, and by means of the relative movement, the one or more holes provided on the second sub-housing can be exposed to form an air duct.
Inventors:
WANG KAI (CN)
Application Number:
PCT/CN2020/118101
Publication Date:
June 17, 2021
Filing Date:
September 27, 2020
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H05K7/20
Foreign References:
| CN109981867A | 2019-07-05 | |||
| CN109585732A | 2019-04-05 | |||
| CN106982537A | 2017-07-25 | |||
| CN204231854U | 2015-03-25 | |||
| CN209043090U | 2019-06-28 | |||
| US20190099286A1 | 2019-04-04 |
Other References:
See also references of EP 4017232A4
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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