Title:
HEAT DISSIPATION MODULE COMPRISING HEAT DISSIPATION LAYER COMPRISING LIGHT-SINTERED METAL-NANO COMPOSITE, AND LIGHTING DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2021/100888
Kind Code:
A1
Abstract:
The present application provides a heat dissipation module comprising a heat dissipation film having high thermal conductivity, and a lighting device comprising same. The present application provides a heat dissipation module comprising: a heat source; a heat dissipation layer for dissipating heat from the heat source; and a heat sink provided on the heat dissipation layer, wherein the heat dissipation layer comprises a light-sintered metal-nanocarbon composite, the amount of nanocarbon contained in the composite is less than 3 wt% with respect to the total weight of the metal, and the thermal conductivity of the heat dissipation layer is 15-30 W/mK.
Inventors:
KIM KWANG SEOK (KR)
CHOI DU YOUNG (KR)
HAN JANG WOO (KR)
CHOI DU YOUNG (KR)
HAN JANG WOO (KR)
Application Number:
PCT/KR2019/015772
Publication Date:
May 27, 2021
Filing Date:
November 18, 2019
Export Citation:
Assignee:
KOREA INST IND TECH (KR)
International Classes:
F21V29/85; F21Y115/10
Foreign References:
| KR101765857B1 | 2017-08-10 | |||
| KR20160119551A | 2016-10-14 | |||
| KR20170135311A | 2017-12-08 | |||
| US20150252241A1 | 2015-09-10 | |||
| CN103108938A | 2013-05-15 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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