Title:
HEAT DISSIPATION MODULE
Document Type and Number:
WIPO Patent Application WO/2022/209164
Kind Code:
A1
Abstract:
This heat dissipation module comprises: a container in which a working fluid is sealed; and at least two porous sheets housed in the container. A vapor channel is formed in the container. A gap for generating capillary force in the working fluid is formed between the porous sheets.
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JPH0749157 | THERMOELECTRIC COOLING/HEATING DEVICE |
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WO/2018/198372 | VAPOR CHAMBER |
Inventors:
HAGINO HARUTOSHI (JP)
KAWAHARA YOJI (JP)
KAWAHARA YOJI (JP)
Application Number:
PCT/JP2022/001595
Publication Date:
October 06, 2022
Filing Date:
January 18, 2022
Export Citation:
Assignee:
FUJIKURA LTD (JP)
International Classes:
F28D15/02; F28D15/04
Foreign References:
JP2010151353A | 2010-07-08 | |||
JP2020101296A | 2020-07-02 | |||
US3681843A | 1972-08-08 | |||
JPS49116647A | 1974-11-07 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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