Title:
HEAT DISSIPATION STRUCTURE, DISPLAY MODULE, ELECTRONIC DEVICE AND PROCESSING METHOD FOR DISPLAY MODULE
Document Type and Number:
WIPO Patent Application WO/2023/226961
Kind Code:
A1
Abstract:
The present disclosure relates to a heat dissipation structure, a display module, an electronic device and a processing method for the display module. The heat dissipation structure comprises a heat dissipation layer, a supporting layer and a second heat dissipation layer, the supporting layer and the second heat dissipation layer being arranged on the same side of the first heat dissipation layer, and the orthographic projections of the supporting layer and the second heat dissipation layer on the first heat dissipation layer do not overlap. The technical solution of the present disclosure effectively solves the problem of uneven heat dissipation of a heat dissipation structure in the prior art.
Inventors:
WANG JIAXIANG (CN)
FENG BINFENG (CN)
ZHANG ZIJIE (CN)
LI FEI (CN)
HUANG QI (CN)
JIN SHANGNAN (CN)
FENG BINFENG (CN)
ZHANG ZIJIE (CN)
LI FEI (CN)
HUANG QI (CN)
JIN SHANGNAN (CN)
Application Number:
PCT/CN2023/095701
Publication Date:
November 30, 2023
Filing Date:
May 23, 2023
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
H05K7/20; G06F9/30
Foreign References:
| CN114916201A | 2022-08-16 | |||
| CN114333589A | 2022-04-12 | |||
| CN111785169A | 2020-10-16 |
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (CN)
Download PDF:
Previous Patent: TRANSMISSION MECHANISM
Next Patent: SEMICONDUCTOR DEVICE, ELECTRONIC CHIP, AND ELECTRONIC DEVICE
Next Patent: SEMICONDUCTOR DEVICE, ELECTRONIC CHIP, AND ELECTRONIC DEVICE