Title:
HEAT EXCHANGE DEVICE AND COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/175782
Kind Code:
A1
Abstract:
The present invention relates to technology for reducing pressure loss in a header pipe in a heat exchanger. This heat exchange device is a parallel-flow heat exchange device configured from a plurality of refrigerant flow paths (1) arranged parallel to each other, a first header pipe (2) for bundling the respective upper sides of the plurality of refrigerant flow paths (1), and a second header pipe (3) for bundling the respective lower sides thereof, in the gravity direction, and is characterized in that the surface (2a) of the first header pipe (2) to which the refrigerant flow paths (1) are connected is a flat surface, and the surface (3a) of the second header pipe (3) to which the refrigerant flow paths (1) are connected is a curved surface.
Inventors:
HACHIYA MAHIRO (JP)
CHIBA MASAKI (JP)
TODOROKI KOICHI (JP)
CHIBA MASAKI (JP)
TODOROKI KOICHI (JP)
Application Number:
PCT/JP2022/011955
Publication Date:
September 21, 2023
Filing Date:
March 16, 2022
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
F28D1/053; F28F9/02
Domestic Patent References:
| WO2019234847A1 | 2019-12-12 | |||
| WO2018179204A1 | 2018-10-04 |
Foreign References:
| KR20070016646A | 2007-02-08 | |||
| JP2005024188A | 2005-01-27 | |||
| JP2020186830A | 2020-11-19 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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