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Title:
HEAT EXCHANGE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/140367
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a heat exchange device in which the heat exchange efficiency of a fluid subject to heat exchange can be improved during overflow, the occurrence of fouling at the periphery of the device can be prevented, cleaning of the interior of a retention tank is facilitated, and the heat exchange efficiency can be maintained. A plurality of small-diameter drip holes 8e are formed in a bottom surface 8d of a retention tank 8 positioned at the upper section of a device body 4, a drainage opening 22 is formed in the center, and an overflow pipe 24 is detachably provided. A guiding plate 26 for guiding a fluid subject to heat exchange that flows out from the overflow pipe 24 toward a drip channel for the fluid subject to heat exchange, which drips down from the drip holes 8e, is positioned on the upper-surface side of a heat exchange unit 29. Even if the fluid subject to heat exchange is supplied in an excessive amount to the retention tank 8, the surplus fluid flows into the overflow pipe 24 and is spread in a planar form and guided to a normal drip channel by the guiding plate 26, a heat exchange process is not needlessly carried out, and the occurrence of fouling at the periphery of the device is also prevented.

Inventors:
HATAMOTO HIROSHI (JP)
MITSUYASU TADASHI (JP)
Application Number:
PCT/JP2023/001799
Publication Date:
July 27, 2023
Filing Date:
January 20, 2023
Export Citation:
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Assignee:
SUISHIN CO LTD (JP)
International Classes:
F28D3/02; F28F25/04
Domestic Patent References:
WO2018189887A12018-10-18
Foreign References:
JPS6179985A1986-04-23
JP6902582B22021-07-14
JPS5755898U1982-04-01
JPH06300469A1994-10-28
JPS6119341Y21986-06-11
JPH027472U1990-01-18
Attorney, Agent or Firm:
KAIZUKA, Ryohei (JP)
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