Title:
HEAT EXCHANGER HAVING HEADER STRUCTURE FOR DISPERSING THERMAL STRESS
Document Type and Number:
WIPO Patent Application WO/2021/167391
Kind Code:
A1
Abstract:
The present invention relates to a heat exchanger having a header structure for dispersing thermal stress. The purpose of the present invention is to provide a heat exchanger having a header structure for dispersing thermal stress, wherein the heat exchanger improves the structure of a tube insertion hole on a header so as to disperse as much thermal stress as possible, by focusing on the fact that thermal stress concentration mainly occurs in a tube nose.
Inventors:
HAN JI HUN (KR)
CHO BYUNG SEON (KR)
CHO BYUNG SEON (KR)
Application Number:
PCT/KR2021/002109
Publication Date:
August 26, 2021
Filing Date:
February 19, 2021
Export Citation:
Assignee:
HANON SYSTEMS (KR)
International Classes:
F28D1/053; F28D21/00; F28F9/02; F28F9/04
Foreign References:
| JP2019190796A | 2019-10-31 | |||
| KR20150078723A | 2015-07-08 | |||
| JP2017075741A | 2017-04-20 | |||
| JP2018169058A | 2018-11-01 | |||
| JP2019090573A | 2019-06-13 |
Attorney, Agent or Firm:
PLUS INTERNATIONAL IP LAW FIRM (KR)
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