HEAT EXCHANGER FOR USE IN COOLING OF SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME

WIPO Patent Application WO/2008/075452

A1

Stable operation and improved reliability of a phase-change heat exchanger provided with microflow passages are realized by controlling the behavior of steam bubbles being produced. In the heat exchanger, the microflow passages are manufactured in two layers and are formed of a material which causes elastic deformation depending upon the difference in pressure between the layers. The layers are connected to each other, and resistance means having a given level of resistance to the flow of a coolant which flows from the coolant supply-side layer into the microflow passage-side layer is provided in the connection part. Under normal conditions,the internal pressure of the coolant supply-side layer is kept at a higher value than the internal pressure of the microflow passages. When steam bubbles are produced, the internal pressure of the microflow passages is rendered higher than the internal pressure of the coolant supply-side layer, whereby the elastic body is lifted and the steam bubbles are dispersed in the plurality of microflow passages. Alternatively, a construction may be adopted in which the internal pressure of the coolant supply-side layer is kept at a lower pressure than the internal pressure of microflow passages and, upon the occurrence of steam bubbles, the steam bubbles are sucked toward a lower pressure side.

SAKAMOTO HITOSHI (JP)
MIKUBO KAZUYUKI (JP)
KITAJO SAKAE (JP)

PCT/JP2007/001339

June 26, 2008

December 03, 2007

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NEC CORP (JP)
SAKAMOTO HITOSHI (JP)
MIKUBO KAZUYUKI (JP)
KITAJO SAKAE (JP)

H01L23/427

JP2005056951A	2005-03-03
JPH09134983A	1997-05-20

HAYAMI, Shinji (9-2 Nishi-Gotanda 7-chom, Shinagawa-ku Tokyo 31, JP)

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