Title:
HEAT EXCHANGING PARTITION WALL
Document Type and Number:
WIPO Patent Application WO/2010/021358
Kind Code:
A1
Abstract:
A board is more effectively cooled and cooling efficiency of the board is further improved. A heat exchanging partition wall (1) is provided with a board (20), and a plurality of pin fins (21) standing on a surface (20a) of the board (20), and a cooling medium (18) is permitted to flow along the surface (20a) of the board (20) in the length direction of the board (20). Each pin fin (21) is tilted to the downstream entirely or partially so that the top surface is positioned in the downstream of the bottom surface.
Inventors:
MIYAKE YOSHIAKI (JP)
Application Number:
PCT/JP2009/064571
Publication Date:
February 25, 2010
Filing Date:
August 20, 2009
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
MIYAKE YOSHIAKI (JP)
MIYAKE YOSHIAKI (JP)
International Classes:
F28F3/12; F02C7/18; F23R3/42; F28F3/02; F28F3/04; F28F3/06
Foreign References:
| JP2005061725A | 2005-03-10 | |||
| JPH0745762A | 1995-02-14 | |||
| JP2002141164A | 2002-05-17 | |||
| JP2001135755A | 2001-05-18 | |||
| JP2005061725A | 2005-03-10 | |||
| JP4084264B2 | 2008-04-30 |
Other References:
See also references of EP 2317270A4
Attorney, Agent or Firm:
FUJITA, Takaharu et al. (JP)
Takaharu Fujita (JP)
Takaharu Fujita (JP)
Download PDF: