Title:
HEAT-EXPANDABLE MICROSPHERES AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/162901
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide heat-expandable microspheres capable of giving hollow particles which can be reduced in the leakage of a blowing agent therefrom with the lapse of time and a use of the heat-expandable microspheres. The heat-expandable microspheres each comprise a shell comprising a thermoplastic resin and a blowing agent that is enclosed in the shell and vaporizes upon heating, wherein the thermoplastic resin is a polymer of polymerizable ingredients including vinylidene chloride (A) and acrylonitrile (B) and satisfies requirements 1 and 2. The total weight proportion of the vinylidene chloride (A) and the acrylonitrile (B) in the polymerizable ingredients is preferably 55-99.9 wt%.
Inventors:
SHIMIZU NAOYA (JP)
UDA TOMOYA (JP)
TAKEUCHI JUN (JP)
UDA TOMOYA (JP)
TAKEUCHI JUN (JP)
Application Number:
PCT/JP2023/005882
Publication Date:
August 31, 2023
Filing Date:
February 20, 2023
Export Citation:
Assignee:
MATSUMOTO YUSHI SEIYAKU KK (JP)
International Classes:
C08J9/32; C09K3/00
Domestic Patent References:
| WO2017141653A1 | 2017-08-24 | |||
| WO2018012415A1 | 2018-01-18 | |||
| WO2016190178A1 | 2016-12-01 | |||
| WO2004074396A1 | 2004-09-02 |
Foreign References:
| JPH0919635A | 1997-01-21 |
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