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Patent Searching and Data


Title:
HEAT-EXPANDING MICROCAPSULE AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2003/099955
Kind Code:
A1
Abstract:
An outer shell comprised of a polymer from a mixture of a nitrile monomer (I), a monomer having, per molecule, one unsaturated double bond and carboxyl (II) and a monomer having, per molecule, two or more polymerizable double bonds (III), optionally together with a monomer copolymerizable with these monomers (IV); and a heat-expanding microcapsule comprising such an outer shell and, enclosed therein, a blowing agent. There are obtained foam particles which, after heat expansion, exhibit a volume retention of 50% or greater under a load of 15 MPa.

Inventors:
MASUDA TOSHIAKI (JP)
TAKAHARA ICHIRO (JP)
FUJIE TAKASHI (JP)
SHIRAKABE YOSHIAKI (JP)
MIKI KATSUSHI (JP)
Application Number:
PCT/JP2003/006409
Publication Date:
December 04, 2003
Filing Date:
May 22, 2003
Export Citation:
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Assignee:
MATSUMOTO YUSHI SEIYAKU KK (JP)
MASUDA TOSHIAKI (JP)
TAKAHARA ICHIRO (JP)
FUJIE TAKASHI (JP)
SHIRAKABE YOSHIAKI (JP)
MIKI KATSUSHI (JP)
International Classes:
B01J13/14; (IPC1-7): C09K3/00; B01J13/14
Foreign References:
EP1067151A12001-01-10
EP1059339A12000-12-13
JPH1053756A1998-02-24
Other References:
See also references of EP 1508604A1
None
Attorney, Agent or Firm:
Ohshima, Masataka (Fukuya Bldg. 3, Yotsuya 4-chom, Shinjuku-ku Tokyo, JP)
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