Title:
HEAT GENERATION ELEMENT COOLING STRUCTURE, HEAT GENERATION ELEMENT COOLING DEVICE, ELECTRONIC DEVICE PROVIDED WITH COOLING DEVICE, AND COOLING DEVICE PRODUCING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/098028
Kind Code:
A1
Abstract:
Disclosed is a heat generation element cooling structure wherein a thermal interface material is provided between heat generation surfaces of a plurality of heat generation elements which are disposed in a planar direction and have different heights and a heat absorption surface of a cooler which faces the heat generation surfaces. The cooler is attached so as to be substantially parallel with an imaginary plane in which the heat absorption surface having a planar shape covers the heat generation surfaces of the heat generation elements. Thus, one surface of the thermal interface material is in close contact with the heat absorption surface of the cooler, and the other surface of the thermal interface material is in close contact with and along the heat generation surfaces of the heat generation elements.
Inventors:
SAKAMOTO HITOSHI (JP)
HASHIGUCHI TAKEYA (JP)
HASHIGUCHI TAKEYA (JP)
Application Number:
PCT/JP2010/000918
Publication Date:
September 02, 2010
Filing Date:
February 15, 2010
Export Citation:
Assignee:
NEC CORP (JP)
SAKAMOTO HITOSHI (JP)
HASHIGUCHI TAKEYA (JP)
SAKAMOTO HITOSHI (JP)
HASHIGUCHI TAKEYA (JP)
International Classes:
H01L23/36; H01L25/04; H01L25/18; H05K7/20
Foreign References:
| JPH08306832A | 1996-11-22 | |||
| JP2000117898A | 2000-04-25 | |||
| JP2004172489A | 2004-06-17 |
Attorney, Agent or Firm:
TANAI, Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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