HEAT-INSULATING FILM AND HEAT-INSULATING FILM STRUCTURE

WIPO Patent Application WO/2015/076317

A1

　Provided are a heat-insulating film exhibiting an improved heat-insulation effect, and a heat-insulating film structure. In the heat-insulating film, porous plate-shaped fillers (1) are disposed so as to be dispersed in a matrix (3m) for binding the porous plate-shaped fillers (1). The porous plate-shaped fillers (1) are shaped as plates having an aspect ratio of 3 or above, a minimum length of 0.1-50 μm, and a porosity of 20-90%. In the heat-insulating film, the proportion of the number of porous plate-shaped fillers (1) in which the filler angle is no greater than 45º is no greater than 50%, the filler angle being the angle between the maximum-length side (1m) of the porous plate-shaped fillers (1) and a vertical line linking the center of the maximum-length side (1m) to a substrate. The heat-insulating film in which the porous plate-shaped fillers (1) are used has a longer heat conduction path than that in a case in which spherical or cubic fillers are used, making it possible to reduce thermal conductivity.

KOBAYASHI HIROHARU (JP)
TOMITA TAKAHIRO (JP)
ORIBE AKINOBU (JP)

PCT/JP2014/080701

May 28, 2015

November 13, 2014

Click for automatic bibliography generation  

NGK INSULATORS LTD (JP)

B32B7/027; C09D201/00; B32B27/18; F16L59/00

WO2013129430A1	2013-09-06
WO2013125704A1	2013-08-29
WO2013191263A1	2013-12-27

JP2007112948A	2007-05-10
JP2005281400A	2005-10-13
JP2011122074A	2011-06-23
JP2004067500A	2004-03-04
JP2004043291A	2004-02-12
JP2006521463A	2006-09-21
JP2008506802A	2008-03-06
JP2005517620A	2005-06-16
JP2010500468A	2010-01-07
JPH09295872A	1997-11-18
JP2000044843A	2000-02-15

WATANABE, Kazuhira (JP)
Ippei Watanabe (JP)

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