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Patent Searching and Data


Title:
HEAT INSULATING PANEL AND HEAT INSULATING STRUCTURE UTILIZING THE HEAT INSULATING PANEL
Document Type and Number:
WIPO Patent Application WO/2005/057077
Kind Code:
A1
Abstract:
A heat insulating panel easily manufacturable, capable of retaining the shape thereof, and having excellent thermal insulation, soundproofness, dewing prevention effect, and strength. The heat insulating panel (10) is formed in a generally square shape and comprises a convex part (12) having two opposed principal planes (16) and (18) swelled in the same direction and a flat plane part (14) around the convex part. The peripheral areas of the principal planes (16) and (18) are sealed by edges (20), and a hollow part inside the principal planes is formed in a depressurized state or a vacuum state. When the hollow part between the principal planes (16) and (18) is vacuated, the excellent thermal insulation and soundproofness can be provided and also the dewing can be prevented from occurring. In addition, since the generally entire part of both principal planes (16) and (18) is formed in a shape curved in the same direction, when the hollow part is vacuated, stresses acting on the principal planes (16) and (18) at their centers are distributed. Since the strength of the heat insulating panel (10) is increased, the shape of the insulation panel (10) can be retained.

Inventors:
TAKESHIMA KAORI (JP)
Application Number:
PCT/JP2004/018414
Publication Date:
June 23, 2005
Filing Date:
December 09, 2004
Export Citation:
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Assignee:
TAKESHIMA KAORI (JP)
International Classes:
E04B1/80; E04D1/28; E04D3/35; E04D13/03; F16L59/065; (IPC1-7): F16L59/065; E04D1/28; E04B1/90
Foreign References:
JPH05509381A1993-12-22
JP2004132438A2004-04-30
JPH0415398A1992-01-20
Attorney, Agent or Firm:
Kajihara, Yasutoshi (Saiwai-cho Kawaguchi-sh, Saitama 16, JP)
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