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Title:
HEAT-INSULATION FILM, AND HEAT-INSULATION-FILM STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/076176
Kind Code:
A1
Abstract:
Provided are: a heat-insulation film with which a heat-insulation effect is improved; and a heat-insulation-film structure. In this heat-insulation film (3), pieces of a porous plate-shaped filler (1) are dispersively disposed in a matrix (3m) for binding together the pieces of the porous plate-shaped filler (1). The pieces of the porous plate-shaped filler (1) have: a plate shape with an aspect ratio of at least 3; a minimum length of 0.1-50 µm; and a porosity of 20-90%. In a cross section parallel to a film thickness direction, when the heat-insulation film (3) is divided, in a direction orthogonal to the film thickness direction, into regions having a region length (26) defined as 10% of the average maximum length of the pieces of the porous plate-shaped filler (1), the regions in which the surface area ratio of the porous plate-shaped filler (1) is less than 50% of the region surface area account for not more than 10% of the total number of regions. This heat-insulation film (3) in which the porous plate-shaped filler (1) is used achieves a longer heat-transfer route length and a lower heat conductivity in comparison to when spherical or cubic fillers are used.

Inventors:
KOBAYASHI HIROHARU (JP)
TOMITA TAKAHIRO (JP)
ORIBE AKINOBU (JP)
Application Number:
PCT/JP2014/080064
Publication Date:
May 28, 2015
Filing Date:
November 13, 2014
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
International Classes:
F16L59/02; B32B7/02; F02B77/11; F02F1/00; F02F3/10
Domestic Patent References:
WO2013125704A12013-08-29
WO2009020206A12009-02-12
WO2010103856A12010-09-16
WO2013133300A12013-09-12
WO2013080389A12013-06-06
Foreign References:
JP2001262067A2001-09-26
JP2011052630A2011-03-17
JP2012167543A2012-09-06
JP2009243352A2009-10-22
JP2012087347A2012-05-10
Attorney, Agent or Firm:
WATANABE, Kazuhira (JP)
Ippei Watanabe (JP)
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