Title:
HEAT PIPE MODULE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/164520
Kind Code:
A1
Abstract:
A heat pipe module and a manufacturing method therefor are disclosed. According to the present invention, a base plate part has a supporting stepped part such that a cover plate part can be accurately mounted on the base plate part and the position of the cover plate part mounted can be firmly fixed. In addition, a fixing member inserted through fixing member coupling holes formed at the cover plate part is coupled to the base plate part such that the cover plate part and the base plate part can be more firmly coupled. Furthermore, the cover plate part has coupling holes such that a second heat pipe part is supported by the cover plate part, and thus a jig for holding a heat pipe part including the second heat pipe part is not required.
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Inventors:
JUNG MIN-HO (KR)
KIM BYEONG-DU (KR)
KIM DONG-HYUN (KR)
KIM BYEONG-DU (KR)
KIM DONG-HYUN (KR)
Application Number:
PCT/KR2018/002794
Publication Date:
September 13, 2018
Filing Date:
March 08, 2018
Export Citation:
Assignee:
SEOUL TELECOM CO LTD (KR)
International Classes:
F28D15/02; B23K1/00; B23K101/14
Foreign References:
| US20070151711A1 | 2007-07-05 | |||
| JP2015227768A | 2015-12-17 | |||
| KR20100014102A | 2010-02-10 | |||
| KR20130001013U | 2013-02-14 | |||
| KR20120100239A | 2012-09-12 | |||
| KR20100038132A | 2010-04-13 |
Attorney, Agent or Firm:
SON, Seung-hee (KR)
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