Title:
HEAT PIPE, SMARTPHONE, TABLET TERMINAL OR PERSONAL DIGITAL ASSISTANT
Document Type and Number:
WIPO Patent Application WO/2014/077081
Kind Code:
A1
Abstract:
[Problem] The invention provides a heat pipe that can be accommodated within a casing of a mobile device such as a smartphone and can yield adequate heat transport performance regardless of the direction of use of the mobile device, which does not have a fixed orientation of use. [Solution] An ultra fine heat pipe (1) comprising an actuating fluid (13) sealed in a copper pipe (12) constituting a pipe body, wherein the diameter of the copper pipe (12) is Φ2.5 mm or less. Preferably, the pipe body is an internally grooved copper pipe (12) comprising pure copper as the material, and the actuating fluid (13) is pure water. The ultra fine heat pipe (1) is arranged along a part of an outer periphery part (38) of a mobile device (31) and a CPU (34) of the mobile device (31), thereby making it possible for the ultra fine heat pipe (1) to be mounted in the casing (32) of a smartphone or other mobile device (31) that is of appropriate size to fit in a hand of a user and is enabled for a cell pack (37) to be detached, and for a sufficient heat transport performance to be achieved.
Inventors:
HONMURA OSAMU (JP)
SAKUMA NAOTO (JP)
KOJIMA NOBUYUKI (JP)
SAKUMA NAOTO (JP)
KOJIMA NOBUYUKI (JP)
Application Number:
PCT/JP2013/078165
Publication Date:
May 22, 2014
Filing Date:
October 17, 2013
Export Citation:
Assignee:
TOSHIBA HOME TECH CORP (JP)
International Classes:
F28D15/02; G06F1/20; G12B15/02; H01L23/427; H04M1/02; H05K7/20
Foreign References:
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Other References:
KEN'ICHIRO UEDA ET AL.: "Effects of Inner Groove Shape on the Heat Transfer Performance of Heat Pipe", FURUKAWA ELECTRIC REVIEW, January 2005 (2005-01-01), pages 1
Attorney, Agent or Firm:
USHIKI, Mamoru (JP)
牛木 護 (JP)
牛木 護 (JP)
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