HEAT PIPE

WIPO Patent Application WO/2014/115839

A1

Provided is a sheet-shaped heat pipe which makes it possible to reduce a pressure loss due to a vapor flow and a pressure loss due to an operating fluid flow to improve a maximum heat transport amount and reduce heat resistance by making the cross-sectional areas of a vapor flow path and a fluid flow path that have been limited by the distance in the height direction of a container larger than those of conventional ones. A heat pipe (10) is provided with: a container (11) in which a hollow portion is formed; a wick structure (13a) which is stored and disposed in the container (11) and generates capillary force; and an operating fluid sealed in the hollow portion in the container (11). The hollow portion of the container (11) is configured from a wick-occupied portion (13) occupied by the wick structure (13a) stored and disposed in the container (11), and a space portion (12) not occupied by the wick structure (13a). In the heat pipe (10), a protruding portion (14) is provided such that the height of the space portion (12) serving as a vapor flow path is higher than the height of the wick-occupied portion (13) serving as a fluid flow path.

JPS5813990	HEAT PIPE
JP3170057	Heat dissipation unit and heat dissipation module
JPH05213295	HEAT PIPE

AOKI HIROFUMI (JP)
IKEDA MASAMI (JP)
INAGAKI YOSHIKATSU (JP)

PCT/JP2014/051500

July 31, 2014

January 24, 2014

Click for automatic bibliography generation  

FURUKAWA ELECTRIC CO LTD (JP)

F28D15/02

WO2013005622A1

2013-01-10

JP2001165584A	2001-06-22
JP2011043320A	2011-03-03
JPH02154990A	1990-06-14
JPH11190596A	1999-07-13
JP2004077120A	2004-03-11

MATSUSHITA, MAKOTO (JP)
Matsushita 亮 (JP)

View/Download PDF      PDF Help

Previous Patent: EJECTOR

Next Patent: LIGHT-RECEIVING DEVICE AND PHASE CYCLE SLIP REDUCTION METHOD