Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/115555
Kind Code:
A1
Abstract:
A heat pump device (100), provided with an evaporator (10), an electrochemical compressor (11), a condenser (16), a coolant transfer path (18), and a non-condensable gas return path (28). The non-condensable gas return path (28) is a different path from the coolant transfer path (18), and is configured to connect the high-pressure space on the discharge side of the electrochemical compressor (11) and the low-pressure space on the intake side of the electrochemical compressor (11), and return the non-condensable gas from the high-pressure space to the low-pressure space. The non-condensable gas is, e.g., hydrogen gas.
Inventors:
SAKAMOTO NAOKI
HARAKI YU
HARAKI YU
Application Number:
PCT/JP2014/000329
Publication Date:
July 31, 2014
Filing Date:
January 23, 2014
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
F25B21/00; F25B23/00; F25B31/00
Foreign References:
| JP2003262424A | 2003-09-19 | |||
| JPH04227440A | 1992-08-17 | |||
| JP2003262423A | 2003-09-19 | |||
| JPH09196504A | 1997-07-31 | |||
| US4593534A | 1986-06-10 |
Attorney, Agent or Firm:
KAMADA, Koichi et al. (JP)
Koichi Kamata (JP)
Koichi Kamata (JP)
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