Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/056648
Kind Code:
A1
Abstract:
The present invention pertains to a heat pump device. At least a compressor (2), a condenser (3), a throttle expander (5), and an evaporator (4) are sequentially connected by connection pipes (6), and an annular coolant circuit is formed. A coolant that has a characteristic in which an isentropic line on a P-h diagram is present in a superheating region on the low-pressure side and has two or more intersections or points of contact with a saturated gas line on the high-pressure side is used as a coolant to be sealed in the coolant circuit. The heat pump device is provided with a discharge-side sensing means (15) for sensing the coolant state on the discharge side of the compressor (2), and a control means (17) for adjusting the coolant state on the discharge side of the compressor (2) on the basis of the output of the discharge-side sensing means (15) so that the coolant during the compression process is always in the superheating region.
Inventors:
KOIKE TAKUTO (JP)
ONISHI YUSUKE (JP)
ONISHI YUSUKE (JP)
Application Number:
PCT/JP2014/077217
Publication Date:
April 23, 2015
Filing Date:
October 10, 2014
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
F25B1/00
Domestic Patent References:
| WO2014017345A1 | 2014-01-30 |
Foreign References:
| JP2012141070A | 2012-07-26 | |||
| JP2011075275A | 2011-04-14 | |||
| JP2003106610A | 2003-04-09 | |||
| JP2012167852A | 2012-09-06 | |||
| JPH01247962A | 1989-10-03 | |||
| JP2008057874A | 2008-03-13 | |||
| JP2007085615A | 2007-04-05 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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