Title:
HEAT PUMP SYSTEM AND CONTROL SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/148866
Kind Code:
A1
Abstract:
This heat pump system comprises a heat pump device, a communication device, an input device, and a control device. The heat pump device controls a temperature to be controlled. The communication device receives, from a server, a signal containing an operation signal pertaining to the operation of the heat pump device. The input device is for enabling the user to enter an instruction for the heat pump device. While the communication device is receiving a signal, the control device causes the heat pump to execute a first operation which is based on the operation signal. If the communication device does not receive a signal during at least a predetermined first period of time, the control device controls the heat pump device so that the heat pump executes a second operation which is based on an instruction entered into the input device.
Inventors:
KADOWAKI KIMITAKA (JP)
NAKAGAWA HIROYUKI (JP)
ITO TAKUYA (JP)
TANIGAWA MASATO (JP)
NAKAGAWA HIROYUKI (JP)
ITO TAKUYA (JP)
TANIGAWA MASATO (JP)
Application Number:
PCT/JP2022/004171
Publication Date:
August 10, 2023
Filing Date:
February 03, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F24H15/375; F25B49/02
Domestic Patent References:
| WO2020202295A1 | 2020-10-08 |
Foreign References:
| JP2007046842A | 2007-02-22 | |||
| JP2015035647A | 2015-02-19 | |||
| JP2014212496A | 2014-11-13 | |||
| JP2021107745A | 2021-07-29 |
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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