Title:
HEAT PUMP SYSTEM AND COOLING SYSTEM USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/045612
Kind Code:
A1
Abstract:
Provided is a heat pump system with good efficiency by reducing the temperature difference to be pumped by a heat pump. A first heat pump (2) has a first evaporator (7) and a second evaporator (8). A second heat pump (3) is coupled to the first heat pump (2) via a condenser (12) that serves as the first evaporator (7). A heat source fluid (16) passes through, in order, the second evaporator (8) of the first heat pump (2) and an evaporator (14) of the second heat pump (3). The fluid to be heated (9) is heated at a condenser (5) of the first heat pump (2) without undergoing a phase change.
Inventors:
KANAMARU MASAYOSHI (JP)
KAWAKAMI AKINORI (JP)
KAWAKAMI AKINORI (JP)
Application Number:
PCT/JP2013/055464
Publication Date:
March 27, 2014
Filing Date:
February 28, 2013
Export Citation:
Assignee:
MIURA KOGYO KK (JP)
International Classes:
F24H1/00; F25B5/04; F25B7/00; F25B27/02; F25B30/02
Foreign References:
| JPS62268960A | 1987-11-21 | |||
| JPS62225860A | 1987-10-03 | |||
| JP2012088005A | 2012-05-10 | |||
| JP2012097993A | 2012-05-24 |
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