HEAT PUMP SYSTEM - MITSUBISHI ELECTRIC CORP

Title:

HEAT PUMP SYSTEM

Document Type and Number:

WIPO Patent Application WO/2016/079829

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a heat pump system such that decomposition of a substance that is contained in a refrigerant and has a C-C double bond is prevented and such that the heating temperature of a heating medium can be elevated. In this heat pump system, a refrigerant containing the substance with a C-C double bond is used, and after a compressor is activated, first, second, and third operations are performed in this order. During the first operation, the specific enthalpy of the refrigerant at the inlet of a pressure-reducing unit is kept at a higher level than the level of the specific enthalpy at the critical point of the substance. During the first operation, the pressure on the high-pressure side is increased from a lower level than the critical pressure of the substance to a higher level than the critical pressure. During the second operation, the pressure on the high-pressure side is kept at a level higher than the critical pressure. During the second operation, the specific enthalpy of the refrigerant at the inlet of the pressure-reducing unit is decreased from a higher level than the specific enthalpy at the critical point to a lower level than the specific enthalpy at the critical point. During the third operation, the temperature of the heating medium flowing out from a heating unit is kept at a level higher than the critical temperature of the substance.

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Inventors:

TAKAYAMA KEISUKE (JP)

Application Number:

PCT/JP2014/080666

Publication Date:

May 26, 2016

Filing Date:

November 19, 2014

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

F25B1/00; F24H1/00; F25B30/02

Domestic Patent References:

WO2012157764A1	2012-11-22
WO2009157320A1	2009-12-30

Foreign References:

JP2010091135A	2010-04-22
JP2005164103A	2005-06-23

Other References: