Title:
HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2016/147389
Kind Code:
A1
Abstract:
This heat pump system is provided with: a compressor that compresses a refrigerant; a first heat exchanger that exchanges heat between a heating medium and the refrigerant compressed by the compressor; a second heat exchanger that exchanges heat between the heating medium and the refrigerant compressed by the compressor; a first pipe in which the refrigerant being supplied from the compressor to the first heat exchanger passes; a second pipe in which the refrigerant returning from the first heat exchanger to the compressor passes; a third pipe in which the refrigerant being supplied from the compressor to the second heat exchanger after returning from the first heat exchanger passes; and a switch device that switches the flow of the heating medium between first mode and second mode. In the first mode, the heating medium flows in series in the first heat exchanger and the second heat exchanger, and in the second mode, the heating medium flows in parallel in the first heat exchanger and the second heat exchanger.
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Inventors:
TAKAYAMA KEISUKE (JP)
Application Number:
PCT/JP2015/058291
Publication Date:
September 22, 2016
Filing Date:
March 19, 2015
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B1/00; F24D3/18; F24H1/00; F25B6/04
Domestic Patent References:
WO2012008431A1 | 2012-01-19 |
Foreign References:
JP2006132427A | 2006-05-25 | |||
JP2008002776A | 2008-01-10 | |||
JP2011153760A | 2011-08-11 | |||
JPS512325Y1 | 1976-01-23 | |||
JP2002048359A | 2002-02-15 |
Other References:
See also references of EP 3273178A4
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
Takada 守 (JP)
Takada 守 (JP)
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