Title:
HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/136459
Kind Code:
A1
Abstract:
The heat pump system uses air as a heat source, and may comprise: a compressor for compressing a refrigerant; a first heat exchanger for allowing heat exchange between the refrigerant and air; a second heat exchanger for allowing heat exchange between the refrigerant and water; a first refrigerant pipe from which the refrigerant having been heat-exchanged in the first heat exchanger is discharged during a defrosting operation for the first heat exchanger; and a second refrigerant pipe for guiding the refrigerant from the first refrigerant pipe to the second heat exchanger. The heat pump system may further comprise: a third refrigerant pipe from which the refrigerant flowing into the second heat exchanger through the second refrigerant pipe and heat-exchanged in the second heat exchanger is discharged; a first water pipe for supplying water to undergo heat exchange in the second heat exchanger; a second water pipe for returning the water having undergone heat exchange in the second heat exchanger; a bypass pipe for connecting the first refrigerant pipe and the third refrigerant pipe so as to bypass the second heat exchanger; and a third heat exchanger for allowing heat exchange between the refrigerant guided by the bypass pipe and the water flowing in the second water pipe during the defrosting operation.
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Inventors:
PYO SOONJAE (KR)
Application Number:
PCT/KR2022/018677
Publication Date:
July 20, 2023
Filing Date:
November 24, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
F25B47/02; F24D3/18; F24D19/10; F25B13/00; F25B25/00; F25B30/02; F25B41/20; F25B41/31; F25B49/02
Domestic Patent References:
| WO2021172868A1 | 2021-09-02 |
Foreign References:
| JP6142711B2 | 2017-06-07 | |||
| KR101641248B1 | 2016-07-20 | |||
| KR19980017695A | 1998-06-05 | |||
| JP2010091131A | 2010-04-22 |
Attorney, Agent or Firm:
SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)
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