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Patent Searching and Data


Title:
HEAT RADIATING LIGHT SOURCE
Document Type and Number:
WIPO Patent Application WO/2020/079976
Kind Code:
A1
Abstract:
Provided is a heat radiating light source that can be installed in a state where a substrate and a heat radiation layer are exposed to the atmosphere and that indicates a large thermal emissivity in a narrow-band wavelength of 4 µm or less and indicates a small thermal emissivity in a wavelength larger than 4 µm. A heat radiation layer N and a substrate K for heating the heat radiation layer N are laminated. The heat radiation layer N is constructed in a state where a radiation control part Na, provided with a MIM laminate M in which a resonance transparent oxide layer R formed by a transparent oxide is positioned between platinum layers P arrayed along the lamination direction, and a radiation transparent oxide layer Nb, formed by a transparent oxide, are laminated such that the radiation control part Na and the radiation transparent oxide layer Nb are disposed closer to the substrate K in this order. The thickness of the resonance transparent oxide layer R is set such that a wavelength of 4 µm or smaller becomes the resonance wavelength.

Inventors:
SUEMITSU MASAHIRO (JP)
SAITO TADASHI (JP)
Application Number:
PCT/JP2019/034562
Publication Date:
April 23, 2020
Filing Date:
September 03, 2019
Export Citation:
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Assignee:
OSAKA GAS CO LTD (JP)
International Classes:
H01K1/04; H01K1/08; H05B3/10
Domestic Patent References:
WO2018182013A12018-10-04
Foreign References:
JP2015158995A2015-09-03
Other References:
MIYAZAKI, T. HIDEKI ET AL.: "Ultraviolet-nanoimprinted packaged metasurface thermal emitters for infrared CO2 sensing", SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, vol. 16, no. 3, 20 March 2015 (2015-03-20), pages 035005, XP055384976
SHEMELYA, C. ET AL.: "Stable high temperature metamaterial emitters for thermophotovoltaic applications", APPLIED PHYSICS LETTERS, vol. 104, 21 March 2014 (2014-03-21), pages 201113, XP012185740
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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